Effect of bonding temperature on the microstructures and strengths of C/C composite/GH3044 alloy joints by partial transient liquid-phase (PTLP) bonding with multiple interlayers

With the use of Ti/Ni/Cu/Ni multiple foils as interlayer, carbon/carbon (C/C) composite was bonded to Ni-based superalloy GH3044 by partial transient liquid-phase bonding technique. The effect of bonding temperature on the microstructures and strengths of the joints was investigated. The results showed that gradient structural multiple interlayers composed of "C-Ti reaction layer/Ti-Ni intermetallic compound layer/Ni-Cu sosoloid/residual Cu layer/Ni-GH3044 diffusion layer" were formed between C/C composite and GH3044. The shear strength of the C/C composite/GH3044 joint reached the highest value of 26.1 MPa when the bonding temperature was 1,030 °C. In addition, the fracture morphology showed that the fracture mode changed with the increase of bonding temperature.