Editorial: Advanced electronic packaging materials: Constitutive model, simulation, design and reliability

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@article{2f3835687a494f97a07025172dc2cee1,

title = "Editorial: Advanced electronic packaging materials: Constitutive model, simulation, design and reliability",

keywords = "advanced electronic packaging, constitutive modeling, diamond/copper composites, multiscale simulation, reliability evaluation",

author = "Yutai Su",

year = "2025",

doi = "10.3389/fmats.2025.1702323",

language = "英语",

volume = "12",

journal = "Frontiers in Materials",

issn = "2296-8016",

publisher = "Frontiers Media SA",

}

TY - JOUR

T1 - Editorial

T2 - Advanced electronic packaging materials: Constitutive model, simulation, design and reliability

AU - Su, Yutai

PY - 2025

Y1 - 2025

KW - advanced electronic packaging

KW - constitutive modeling

KW - diamond/copper composites

KW - multiscale simulation

KW - reliability evaluation

UR - https://www.scopus.com/pages/publications/105020586392

U2 - 10.3389/fmats.2025.1702323

DO - 10.3389/fmats.2025.1702323

M3 - 社论

AN - SCOPUS:105020586392

SN - 2296-8016

VL - 12

JO - Frontiers in Materials

JF - Frontiers in Materials

M1 - 1702323

ER -