TY - JOUR
T1 - Discontinuous plasticity in Sn single crystals
T2 - a combined experiment and modelling study
AU - Xin, Hai
AU - Gu, Tianhong
AU - Giuliani, Finn
AU - Britton, T. Ben
AU - Zhan, Mei
AU - Xu, Yilun
AU - Zheng, Zebang
N1 - Publisher Copyright:
© 2026 The Author(s). Published by Elsevier Ltd. This is an open access article under the CC BY license. http://creativecommons.org/licenses/by/4.0/
PY - 2026/9
Y1 - 2026/9
N2 - Discontinuous plastic flow (DPF) in single-crystal tin (Sn) is investigated through a combined rate-dependent discrete dislocation plasticity (DDP) framework and micropillar compression experiments. The observed stress oscillations are attributed to the thermally activated pinning-depinning dynamics of dislocations interacting with obstacles. The magnitude of these serrations shows a clear dependence on crystallographic orientation, which stems from the variation in thermal activation behavior across different slip systems. By calibrating the thermal activation parameters in the DDP model, the creep behavior of Sn single crystals is quantitatively predicted. A correlation is established between the secondary creep rate and the amplitude of stress oscillations measured in micropillar tests. This study thus offers a physics-based pathway-independently verified-to predict slip-dominated creep rates from small-scale mechanical testing, bridging microstructural features with long-term mechanical performance, and yielding critical insights into the reliability of solder joints.
AB - Discontinuous plastic flow (DPF) in single-crystal tin (Sn) is investigated through a combined rate-dependent discrete dislocation plasticity (DDP) framework and micropillar compression experiments. The observed stress oscillations are attributed to the thermally activated pinning-depinning dynamics of dislocations interacting with obstacles. The magnitude of these serrations shows a clear dependence on crystallographic orientation, which stems from the variation in thermal activation behavior across different slip systems. By calibrating the thermal activation parameters in the DDP model, the creep behavior of Sn single crystals is quantitatively predicted. A correlation is established between the secondary creep rate and the amplitude of stress oscillations measured in micropillar tests. This study thus offers a physics-based pathway-independently verified-to predict slip-dominated creep rates from small-scale mechanical testing, bridging microstructural features with long-term mechanical performance, and yielding critical insights into the reliability of solder joints.
KW - Discontinuous plasticity flow
KW - Discrete dislocation plasticity
KW - Micropillar compression
KW - Single crystal
UR - https://www.scopus.com/pages/publications/105041318301
U2 - 10.1016/j.jmps.2026.106714
DO - 10.1016/j.jmps.2026.106714
M3 - 文章
AN - SCOPUS:105041318301
SN - 0022-5096
VL - 215
JO - Journal of the Mechanics and Physics of Solids
JF - Journal of the Mechanics and Physics of Solids
M1 - 106714
ER -