Design of low temperature (54 K) reusable test fixture based on pogo pin and Al2O3 HTCC ceramics

In this paper, a new three-dimensional vertical interconnected low-temperature reusable test fixture based on pogo pins and Al2O3 HTCC ceramics is designed, and a low-noise amplifier (LNA) chip with a frequency range of 1-1.6 GHZ is selected for verification. In the fixture design, a support module is constructed at the bottom utilizing PCB technology, while a detachable test module is implemented at the top using Al2O3 HTCC. Additionally, a novel vertical quasi-coaxial transmission structure, employing pogo pins, is proposed for the interconnection between the bottom and top modules of the fixture. After successful design and packaging, the monolithic microwave integrated circuit (MMIC) LNA chip was measured at temperatures of 54 K, 77 K, 218 K, and 297 K. The measured results closely matched the simulations. Notably, at temperatures of 74 K and 55 K, the chip exhibited a gain exceeding 40 dB with a noise factor (NF) of less than 0.2 dB.