Creep behavior of a film cooling hole at different inclination angles in complex temperature fields

We studied the creep behavior of thin-walled plates with a single film cooling hole at different inclination angles in complex temperature fields. Numerical simulations were carried out by combining the conjugate heat transfer and crystal plastic finite element methods. Simulation results showed that 30° and 45° holes had superior cooling performance, especially 45° holes had better lifetime characteristics. We found that decreasing the inclination angle and increasing the blowing ratio both increase the temperature difference around the hole along the wall thickness direction, which in turn generates additional stress concentrations on the acute side of the cold surface, but did not have a significant effect on the stress distribution. In addition, during film cooling, high temperatures lead to creep damage on the acute side of the hot surface, and large temperature differences together with low temperatures determine damage on the acute side of the cold surface.[Figure not available: see fulltext.].