Cellular spacing selection of Cu-Mn alloy under ultrahigh temperature gradient and rapid solidification condition

S. Yang; Y. P. Su; Z. X. Liu; W. D. Huang; Y. H. Zhou

Cellular spacing selection of Cu-Mn alloy under ultrahigh temperature gradient and rapid solidification condition

S. Yang
, Y. P. Su
, Z. X. Liu
, W. D. Huang
, Y. H. Zhou

材料学院

Northwestern Polytechnical University Xian

科研成果: 期刊稿件 › 文章 › 同行评审

摘要

Cellular spacing selection of Cu-27.3 wt pct Mn alloy has been investigated by laser surface rapid resolidification experiments. The experimental results show that there exists a wide distribution range in cellular spacing under ultra-high temperature gradient and rapid solidification conditions and the average spacing decreases with the increase of growth rate. The experimental results are compared with the current KGT model for rapid cellular/dendritic growth, and a reasonable agreement is found.

源语言	英语
页（从-至）	85-86
页数	2
期刊	Journal of Materials Science and Technology
卷	17
期	1
出版状态	已出版 - 1月 2001

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@article{0f5aecb0ace84306b19aaec5a4b31fad,

title = "Cellular spacing selection of Cu-Mn alloy under ultrahigh temperature gradient and rapid solidification condition",

abstract = "Cellular spacing selection of Cu-27.3 wt pct Mn alloy has been investigated by laser surface rapid resolidification experiments. The experimental results show that there exists a wide distribution range in cellular spacing under ultra-high temperature gradient and rapid solidification conditions and the average spacing decreases with the increase of growth rate. The experimental results are compared with the current KGT model for rapid cellular/dendritic growth, and a reasonable agreement is found.",

author = "S. Yang and Su, \{Y. P.\} and Liu, \{Z. X.\} and Huang, \{W. D.\} and Zhou, \{Y. H.\}",

year = "2001",

month = jan,

language = "英语",

volume = "17",

pages = "85--86",

journal = "Journal of Materials Science and Technology",

issn = "1005-0302",

publisher = "Chinese Society of Metals",

number = "1",

}

TY - JOUR

T1 - Cellular spacing selection of Cu-Mn alloy under ultrahigh temperature gradient and rapid solidification condition

AU - Yang, S.

AU - Su, Y. P.

AU - Liu, Z. X.

AU - Huang, W. D.

AU - Zhou, Y. H.

PY - 2001/1

Y1 - 2001/1

N2 - Cellular spacing selection of Cu-27.3 wt pct Mn alloy has been investigated by laser surface rapid resolidification experiments. The experimental results show that there exists a wide distribution range in cellular spacing under ultra-high temperature gradient and rapid solidification conditions and the average spacing decreases with the increase of growth rate. The experimental results are compared with the current KGT model for rapid cellular/dendritic growth, and a reasonable agreement is found.

AB - Cellular spacing selection of Cu-27.3 wt pct Mn alloy has been investigated by laser surface rapid resolidification experiments. The experimental results show that there exists a wide distribution range in cellular spacing under ultra-high temperature gradient and rapid solidification conditions and the average spacing decreases with the increase of growth rate. The experimental results are compared with the current KGT model for rapid cellular/dendritic growth, and a reasonable agreement is found.

UR - https://www.scopus.com/pages/publications/0034784053

M3 - 文章

AN - SCOPUS:0034784053

SN - 1005-0302

VL - 17

SP - 85

EP - 86

JO - Journal of Materials Science and Technology

JF - Journal of Materials Science and Technology

IS - 1

ER -

Cellular spacing selection of Cu-Mn alloy under ultrahigh temperature gradient and rapid solidification condition

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