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Asymmetric phase-change composites for green electromagnetic interference shielding and efficient thermal management

  • Pengcheng Zhang
  • , Haoyu Liang
  • , Huanping Wang
  • , Haiyang Zhang
  • , Haozhe Wu
  • , Yuxin Shi
  • , Yujie Liu
  • , Qiuyu Zhang
  • , Yanhui Chen
  • Northwestern Polytechnical University Xian
  • Queen Mary University of London

科研成果: 期刊稿件 › 文章 › 同行评审

3 引用 (Scopus)

摘要

With the rapid expansion of 5 G technology and high-power electronics, the development of materials that simultaneously address electromagnetic interference (EMI) and overheating remains a significant challenge. In this study, an asymmetric polyimide (PI)-based phase change composite material with two complementary functional layers is developed using an “in-situ monolithic formation” process. The top layer consists of a low-conductivity (10−3 to 10−2 S/m) MXene/PI aerogel impregnated with polyethylene glycol (PEG), which serves as an impedance-matching layer for incident electromagnetic wave penetration and absorption, and as a medium for efficient latent heat storage. In contrast, the bottom layer is a high-conductivity (10 ³ S/m) MXene/PI film that reflects the penetrating electromagnetic waves and promotes in-plane heat spreading. This synergistic architecture demonstrates an outstanding EMI shielding effectiveness (SE) of 46.7 dB and an impressive absorption coefficient (A) of 0.6, realizing an absorption-dominated green EMI shielding. Furthermore, owing to the high enthalpy (191.8 J/g) of the composite phase-change material and the thermal diffusion effect of the MXene/PI film, the composite exhibits outstanding thermal management and uniform heat transfer capabilities, as confirmed by both thermal management experiments and COMSOL simulations. Its structural integrity is equally impressive, with excellent anti-leakage properties and remarkable cyclic stability. After 100 heating-cooling cycles, the material retains a high enthalpy retention rate of 99.49 %, underscoring its durability and reliability. This work not only introduces a high-performance material but also provides a promising design framework for multifunctional composites in next-generation electronic devices.

源语言英语
期刊论文编号184397
期刊Journal of Alloys and Compounds
卷1044
DOI
出版状态已出版 - 5 11月 2025

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