TY - JOUR
T1 - Asymmetric phase-change composites for green electromagnetic interference shielding and efficient thermal management
AU - Zhang, Pengcheng
AU - Liang, Haoyu
AU - Wang, Huanping
AU - Zhang, Haiyang
AU - Wu, Haozhe
AU - Shi, Yuxin
AU - Liu, Yujie
AU - Zhang, Qiuyu
AU - Chen, Yanhui
N1 - Publisher Copyright:
© 2025 Elsevier B.V.
PY - 2025/11/5
Y1 - 2025/11/5
N2 - With the rapid expansion of 5 G technology and high-power electronics, the development of materials that simultaneously address electromagnetic interference (EMI) and overheating remains a significant challenge. In this study, an asymmetric polyimide (PI)-based phase change composite material with two complementary functional layers is developed using an “in-situ monolithic formation” process. The top layer consists of a low-conductivity (10−3 to 10−2 S/m) MXene/PI aerogel impregnated with polyethylene glycol (PEG), which serves as an impedance-matching layer for incident electromagnetic wave penetration and absorption, and as a medium for efficient latent heat storage. In contrast, the bottom layer is a high-conductivity (10 ³ S/m) MXene/PI film that reflects the penetrating electromagnetic waves and promotes in-plane heat spreading. This synergistic architecture demonstrates an outstanding EMI shielding effectiveness (SE) of 46.7 dB and an impressive absorption coefficient (A) of 0.6, realizing an absorption-dominated green EMI shielding. Furthermore, owing to the high enthalpy (191.8 J/g) of the composite phase-change material and the thermal diffusion effect of the MXene/PI film, the composite exhibits outstanding thermal management and uniform heat transfer capabilities, as confirmed by both thermal management experiments and COMSOL simulations. Its structural integrity is equally impressive, with excellent anti-leakage properties and remarkable cyclic stability. After 100 heating-cooling cycles, the material retains a high enthalpy retention rate of 99.49 %, underscoring its durability and reliability. This work not only introduces a high-performance material but also provides a promising design framework for multifunctional composites in next-generation electronic devices.
AB - With the rapid expansion of 5 G technology and high-power electronics, the development of materials that simultaneously address electromagnetic interference (EMI) and overheating remains a significant challenge. In this study, an asymmetric polyimide (PI)-based phase change composite material with two complementary functional layers is developed using an “in-situ monolithic formation” process. The top layer consists of a low-conductivity (10−3 to 10−2 S/m) MXene/PI aerogel impregnated with polyethylene glycol (PEG), which serves as an impedance-matching layer for incident electromagnetic wave penetration and absorption, and as a medium for efficient latent heat storage. In contrast, the bottom layer is a high-conductivity (10 ³ S/m) MXene/PI film that reflects the penetrating electromagnetic waves and promotes in-plane heat spreading. This synergistic architecture demonstrates an outstanding EMI shielding effectiveness (SE) of 46.7 dB and an impressive absorption coefficient (A) of 0.6, realizing an absorption-dominated green EMI shielding. Furthermore, owing to the high enthalpy (191.8 J/g) of the composite phase-change material and the thermal diffusion effect of the MXene/PI film, the composite exhibits outstanding thermal management and uniform heat transfer capabilities, as confirmed by both thermal management experiments and COMSOL simulations. Its structural integrity is equally impressive, with excellent anti-leakage properties and remarkable cyclic stability. After 100 heating-cooling cycles, the material retains a high enthalpy retention rate of 99.49 %, underscoring its durability and reliability. This work not only introduces a high-performance material but also provides a promising design framework for multifunctional composites in next-generation electronic devices.
KW - Absorption-dominated EMI shielding
KW - Asymmetric structure
KW - Phase change materials
KW - Thermal management
UR - https://www.scopus.com/pages/publications/105018580338
U2 - 10.1016/j.jallcom.2025.184397
DO - 10.1016/j.jallcom.2025.184397
M3 - 文章
AN - SCOPUS:105018580338
SN - 0925-8388
VL - 1044
JO - Journal of Alloys and Compounds
JF - Journal of Alloys and Compounds
M1 - 184397
ER -