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An Intelligent Quantitative Evaluation Method of Baked Goods Quality Based on Vision

  • Northwestern Polytechnical University Xian
  • Ningbo FOTILE Kitchen Ware Co Ltd

科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审

摘要

The uneven temperature field in the oven will not only affect the beauty of baked goods, but also directly related to food safety. The quantitative evaluation method of baking quality based on vision is a non-contact standardized test method, and the results can provide a basis for the design optimization of internal temperature field of household oven. However, the mapping relationship between oven temperature field and baking state of baked goods is uncertain. Therefore, it is necessary to design a method to detect the baking quality of the baked goods. By judging the baking state of the baked goods under a certain temperature field, the performance of the temperature field produced by the oven can be obtained. In this paper, the proposed intelligent quantitative evaluation method of baking quality includes four parts: 1. Designing the cabinet of baking image acquisition equipment to capture the baking image under the condition of consistent light source; 2. Based on HSV - LBP feature, the light weight baked goods segmentation algorithm can obtain the pure baked goods region; 3. The surface consistency of baked goods was evaluated based on multi-scale variance; 4. The baking state of the baked goods was obtained based on the evaluation index of the baking state of the baked goods in Lab color space. The proposed method was used to evaluate the baking state of two representative baked goods, toast and cookies, and the results were compared with the manual test results, which proved the effectiveness and robustness of the proposed method.

源语言英语
主期刊名Proceedings of 2023 IEEE 16th International Conference on Electronic Measurement and Instruments, ICEMI 2023
编辑Juan Wu, Jiali Yin
出版商Institute of Electrical and Electronics Engineers Inc.
页211-217
页数7
ISBN(电子版)9798350327144
DOI
出版状态已出版 - 2023
活动16th IEEE International Conference on Electronic Measurement and Instruments, ICEMI 2023 - Harbin, 中国
期限: 9 8月 2023 → 11 8月 2023

丛书

姓名Proceedings of 2023 IEEE 16th International Conference on Electronic Measurement and Instruments, ICEMI 2023

会议

会议16th IEEE International Conference on Electronic Measurement and Instruments, ICEMI 2023
国家/地区中国
市Harbin
时期9/08/23 → 11/08/23

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