A Wafer-Level Vacuum Packaged MEMS Disk Resonator Gyroscope with 0.42°/h Bias Instability Within ±300°/s Full Scale

Hao Wang; Haiyang Quan; Jinqiu Zhou; Long Zhang; Jianbing Xie; Honglong Chang

doi:10.1109/TIE.2021.3078375

A Wafer-Level Vacuum Packaged MEMS Disk Resonator Gyroscope with 0.42°/h Bias Instability Within ±300°/s Full Scale

Hao Wang
, Haiyang Quan
, Jinqiu Zhou
, Long Zhang
, Jianbing Xie
, Honglong Chang

机电学院

Northwestern Polytechnical University Xian
Beijing Microelectronics Technology Institute

科研成果: 期刊稿件 › 文章 › 同行评审

30 引用（Scopus）

摘要

This article reports a MEMS disk resonator gyroscope (DRG) with superior overall performance in terms of bias instability, measurement range, and size. Specifically, a fully filled electrodes MEMS DRG is proposed to improve sensing capacitance to 23.66 pF and drive capacitance to 6.14 pF. The DRG is fabricated using a wafer-level vacuum-package process and is controlled and sensed by a configurable ASIC, enabling a small footprint. The DRG achieves an angle random walk of 0.05°/√h and bias instability of 0.42°/h within a full scale of ±300°/s, making it a very promising solution for angular measurement in high-end industrial applications.

源语言	英语
页（从-至）	5304-5313
页数	10
期刊	IEEE Transactions on Industrial Electronics
卷	69
期	5
DOI	https://doi.org/10.1109/TIE.2021.3078375
出版状态	已出版 - 1 5月 2022

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10.1109/TIE.2021.3078375

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title = "A Wafer-Level Vacuum Packaged MEMS Disk Resonator Gyroscope with 0.42°/h Bias Instability Within ±300°/s Full Scale",

abstract = "This article reports a MEMS disk resonator gyroscope (DRG) with superior overall performance in terms of bias instability, measurement range, and size. Specifically, a fully filled electrodes MEMS DRG is proposed to improve sensing capacitance to 23.66 pF and drive capacitance to 6.14 pF. The DRG is fabricated using a wafer-level vacuum-package process and is controlled and sensed by a configurable ASIC, enabling a small footprint. The DRG achieves an angle random walk of 0.05°/√h and bias instability of 0.42°/h within a full scale of ±300°/s, making it a very promising solution for angular measurement in high-end industrial applications.",

keywords = "Bias instability, disk resonator gyroscope (DRG), wafer-level vacuum package (WLVP)",

author = "Hao Wang and Haiyang Quan and Jinqiu Zhou and Long Zhang and Jianbing Xie and Honglong Chang",

note = "Publisher Copyright: {\textcopyright} 1982-2012 IEEE.",

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doi = "10.1109/TIE.2021.3078375",

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AU - Quan, Haiyang

AU - Zhou, Jinqiu

AU - Zhang, Long

AU - Xie, Jianbing

AU - Chang, Honglong

PY - 2022/5/1

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N2 - This article reports a MEMS disk resonator gyroscope (DRG) with superior overall performance in terms of bias instability, measurement range, and size. Specifically, a fully filled electrodes MEMS DRG is proposed to improve sensing capacitance to 23.66 pF and drive capacitance to 6.14 pF. The DRG is fabricated using a wafer-level vacuum-package process and is controlled and sensed by a configurable ASIC, enabling a small footprint. The DRG achieves an angle random walk of 0.05°/√h and bias instability of 0.42°/h within a full scale of ±300°/s, making it a very promising solution for angular measurement in high-end industrial applications.

AB - This article reports a MEMS disk resonator gyroscope (DRG) with superior overall performance in terms of bias instability, measurement range, and size. Specifically, a fully filled electrodes MEMS DRG is proposed to improve sensing capacitance to 23.66 pF and drive capacitance to 6.14 pF. The DRG is fabricated using a wafer-level vacuum-package process and is controlled and sensed by a configurable ASIC, enabling a small footprint. The DRG achieves an angle random walk of 0.05°/√h and bias instability of 0.42°/h within a full scale of ±300°/s, making it a very promising solution for angular measurement in high-end industrial applications.

KW - Bias instability

KW - disk resonator gyroscope (DRG)

KW - wafer-level vacuum package (WLVP)

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A Wafer-Level Vacuum Packaged MEMS Disk Resonator Gyroscope with 0.42°/h Bias Instability Within ±300°/s Full Scale

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