@inproceedings{8117831c099d4902943c5d917ea78fb9,
title = "A Study on the technical method of drilling micro holes on new CMC-SiC with femtosecond laser",
abstract = "To solve the difficulties of processing micro holes on the CMC-SiC, femtosecond laser was used as the drilling tool in this paper. And a new type of laser beam scanning module was studied. The study confirms the feasibility of finishing the processing of micro holes whose diameter is less than 2mm on the new CMC-SiC. And the preliminary optimization of processing parameters is completed. According to the experimental results, the important factors affecting the quality of the micro holes were analyzed, and the factors are the processing power and the scanning speed. The results also show that the femtosecond laser processing technology can solve the difficulties of drilling mirco holes on the new CMC-SiC in our country's aerospace field.",
keywords = "CMC-SiC, Femtosecond laser, Laser processing, Micro holes, Taper",
author = "Wang Feng and Luo, \{Jian Jun\} and Ming Li and Yue Deng",
year = "2014",
doi = "10.4028/www.scientific.net/AMM.543-547.3924",
language = "英语",
isbn = "9783038350606",
series = "Applied Mechanics and Materials",
publisher = "Trans Tech Publications",
pages = "3924--3930",
booktitle = "Vehicle, Mechatronics and Information Technologies II",
note = "International Conference on Vehicle and Mechanical Engineering and Information Technology, VMEIT 2014 ; Conference date: 19-02-2014 Through 20-02-2014",
}