TY - GEN
T1 - A sensor for stiffness change sensing based on three weakly coupled resonators with enhanced sensitivity
AU - Zhao, Chun
AU - Wood, Graham S.
AU - Xie, Jianbing
AU - Chang, Honglong
AU - Pu, Suan Hui
AU - Chong, Harold M.H.
AU - Kraft, Michael
N1 - Publisher Copyright:
© 2015 IEEE.
PY - 2015/2/26
Y1 - 2015/2/26
N2 - This paper reports on a novel MEMS resonant sensing device consisting of three weakly coupled resonators that can achieve an order of magnitude improvement in sensitivity to stiffness change, compared to current state-of-the-art resonator sensors with similar size and resonant frequency. In a 3 degree-of-freedom (DoF) system, if an external stimulus causes change in the spring stiffness of one resonator, mode localization occurs, leading to a drastic change of mode shape, which can be detected by measuring the modal amplitude ratio change. A 49 times improvement in sensitivity compared to a previously reported 2DoF resonator sensor, and 4 orders of magnitude enhancement compared to a 1DoF resonator sensor has been achieved.
AB - This paper reports on a novel MEMS resonant sensing device consisting of three weakly coupled resonators that can achieve an order of magnitude improvement in sensitivity to stiffness change, compared to current state-of-the-art resonator sensors with similar size and resonant frequency. In a 3 degree-of-freedom (DoF) system, if an external stimulus causes change in the spring stiffness of one resonator, mode localization occurs, leading to a drastic change of mode shape, which can be detected by measuring the modal amplitude ratio change. A 49 times improvement in sensitivity compared to a previously reported 2DoF resonator sensor, and 4 orders of magnitude enhancement compared to a 1DoF resonator sensor has been achieved.
UR - https://www.scopus.com/pages/publications/84931065208
U2 - 10.1109/MEMSYS.2015.7051100
DO - 10.1109/MEMSYS.2015.7051100
M3 - 会议稿件
AN - SCOPUS:84931065208
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 881
EP - 884
BT - 2015 28th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2015
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2015 28th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2015
Y2 - 18 January 2015 through 22 January 2015
ER -