TY - JOUR
T1 - A new integrated modeling method for investigating the impact of cure process on the compressive response of z-pinned CFRP laminates
AU - Zhang, Shengnan
AU - Jia, Yutong
AU - Xu, Yingjie
AU - Zhang, Weihong
N1 - Publisher Copyright:
© 2025 Elsevier Ltd
PY - 2025/10/15
Y1 - 2025/10/15
N2 - The application of z-pinning significantly enhances the interlaminar performance of carbon fiber reinforced polymer (CFRP) composites. However, the insertion of z-pins can induce fiber distortion with the formation of resin-rich regions, which may compromise in-plane mechanical properties. This study considers the influence of the cure process on the in-plane compressive behavior of z-pinned laminates. A novel micromechanical model is proposed that incorporates temporal material curing properties. The model employs a cohesive element approach with a bilinear constitutive law to accurately simulate interactions within the z-pins and resin-rich regions. As a consequence of pronounced discrepancies in thermal expansion and chemical shrinkage, substantial residual stresses develop around the z-pins following curing. Under compressive loading, the interface with reduced mechanical integrity is prone to initial crack formation, with progressive damage that is propagated into adjacent resin-rich areas. In addition, a parametric analysis has been conducted to evaluate the effects of various z-pin diameters and z-pin densities on the in-plane compressive characteristics, offering valuable insights for optimizing high in-plane mechanical performance.
AB - The application of z-pinning significantly enhances the interlaminar performance of carbon fiber reinforced polymer (CFRP) composites. However, the insertion of z-pins can induce fiber distortion with the formation of resin-rich regions, which may compromise in-plane mechanical properties. This study considers the influence of the cure process on the in-plane compressive behavior of z-pinned laminates. A novel micromechanical model is proposed that incorporates temporal material curing properties. The model employs a cohesive element approach with a bilinear constitutive law to accurately simulate interactions within the z-pins and resin-rich regions. As a consequence of pronounced discrepancies in thermal expansion and chemical shrinkage, substantial residual stresses develop around the z-pins following curing. Under compressive loading, the interface with reduced mechanical integrity is prone to initial crack formation, with progressive damage that is propagated into adjacent resin-rich areas. In addition, a parametric analysis has been conducted to evaluate the effects of various z-pin diameters and z-pin densities on the in-plane compressive characteristics, offering valuable insights for optimizing high in-plane mechanical performance.
KW - Curing residual stress
KW - Finite element
KW - Mechanical properties
KW - Microstructural characteristics
KW - Resin matrix composites
KW - Through-thickness reinforcement
UR - https://www.scopus.com/pages/publications/105008649420
U2 - 10.1016/j.compstruct.2025.119415
DO - 10.1016/j.compstruct.2025.119415
M3 - 文章
AN - SCOPUS:105008649420
SN - 0263-8223
VL - 370
JO - Composite Structures
JF - Composite Structures
M1 - 119415
ER -