TY - GEN
T1 - A new fabrication process for microstructures with high area-to-mass ratios by stiffness enhancement
AU - Ren, Zhongjing
AU - Yuan, Jianping
AU - Su, Xiaoyu
AU - Sun, Hao
AU - Galos, Richard
AU - Shi, Yong
N1 - Publisher Copyright:
Copyright © 2018 ASME.
PY - 2018
Y1 - 2018
N2 - A new fabrication process for stiffness-enhanced microstructures with high area-to-mass ratios is presented in this paper. In order to acquire an enhanced stiffness without ruining the structural parameter of area-to-mass ratio, multilayered metallic microstructures are proposed and fabricated by surface and bulk fabrication processes from Micro-Electro-Mechanical Systems (MEMS) technologies. Microstructures based on beams with symmetrically deposited metals are physically built and tested on wafers. A sacrificial silicon layer is used to form gaps between bimetal layers and the microstructures can be deployed vertically when heated due to the effect of thermal mismatch between different materials. The results show a dramatic thickness increase when actuated by Joule heating, and thus a great bending stiffness enhancement.
AB - A new fabrication process for stiffness-enhanced microstructures with high area-to-mass ratios is presented in this paper. In order to acquire an enhanced stiffness without ruining the structural parameter of area-to-mass ratio, multilayered metallic microstructures are proposed and fabricated by surface and bulk fabrication processes from Micro-Electro-Mechanical Systems (MEMS) technologies. Microstructures based on beams with symmetrically deposited metals are physically built and tested on wafers. A sacrificial silicon layer is used to form gaps between bimetal layers and the microstructures can be deployed vertically when heated due to the effect of thermal mismatch between different materials. The results show a dramatic thickness increase when actuated by Joule heating, and thus a great bending stiffness enhancement.
UR - https://www.scopus.com/pages/publications/85056861896
U2 - 10.1115/DETC2018-86282
DO - 10.1115/DETC2018-86282
M3 - 会议稿件
AN - SCOPUS:85056861896
T3 - Proceedings of the ASME Design Engineering Technical Conference
BT - 23rd Design for Manufacturing and the Life Cycle Conference; 12th International Conference on Micro- and Nanosystems
PB - American Society of Mechanical Engineers (ASME)
T2 - ASME 2018 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE 2018
Y2 - 26 August 2018 through 29 August 2018
ER -