TY - GEN
T1 - A Micro Resonant DC Electric Field Sensor Based on Mode Localization Phenomenon
AU - Yan, Zimu
AU - Liang, Jiaju
AU - Hao, Yongcun
AU - Chang, Honglong
N1 - Publisher Copyright:
© 2019 IEEE.
PY - 2019/1
Y1 - 2019/1
N2 - This paper for the first time reports a resonant DC electric field sensor (EFS) based on the mode localization phenomenon. The sensor uses a 3-degrees-of-freedom (DoF) weakly coupled resonator (WCR) as the mechanical sensing element, with comb capacitors on both sides for converting electric field to stiffness perturbation. The perturbation causes a drastic change in the mode shape owing to the mode localization phenomenon. Then we use the amplitude ratio (AR) instead of the frequency as the readout metric, and the sensitivity based on the AR is 1720 times higher than that based on the frequency. Just under the open-loop test, the resolution of the sensor reaches 20.4V/m√ Hz in the range of 7 kV.
AB - This paper for the first time reports a resonant DC electric field sensor (EFS) based on the mode localization phenomenon. The sensor uses a 3-degrees-of-freedom (DoF) weakly coupled resonator (WCR) as the mechanical sensing element, with comb capacitors on both sides for converting electric field to stiffness perturbation. The perturbation causes a drastic change in the mode shape owing to the mode localization phenomenon. Then we use the amplitude ratio (AR) instead of the frequency as the readout metric, and the sensitivity based on the AR is 1720 times higher than that based on the frequency. Just under the open-loop test, the resolution of the sensor reaches 20.4V/m√ Hz in the range of 7 kV.
UR - https://www.scopus.com/pages/publications/85074349688
U2 - 10.1109/MEMSYS.2019.8870880
DO - 10.1109/MEMSYS.2019.8870880
M3 - 会议稿件
AN - SCOPUS:85074349688
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 849
EP - 852
BT - 2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems, MEMS 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 32nd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2019
Y2 - 27 January 2019 through 31 January 2019
ER -