TY - JOUR
T1 - A capacitive-piezoelectric hybrid MEMS microphone with signal fusion for enhancing signal-to-noise ratio
AU - Guan, Yangyang
AU - Schneider, Michael
AU - Li, Dongsheng
AU - Zhang, Hemin
AU - Mi, Jing
AU - Bertrand, Alexander
AU - Sadeghpour, Sina
AU - Wang, Chen
AU - Liu, Huicong
AU - Glorieux, Christ
AU - Kraft, Michael
N1 - Publisher Copyright:
© The Author(s) 2026.
PY - 2026/12
Y1 - 2026/12
N2 - This work describes a hybrid micro-electro-mechanical-systems (MEMS) microphone integrating capacitive and piezoelectric transduction mechanisms for signal-to-noise ratio (SNR) improvement. A theoretical system-level model was established to characterize the hybrid device, which was fabricated using a silicon-on-insulator (SOI) wafer-based process. The piezoelectric transduction component employs a Si/SiO2/Au/AlN/Pt material stack, while the capacitive transduction part consists of a variable capacitor formed by a silicon handle layer and a silicon device layer. Experimental results at 1 kHz show that the hybrid MEMS microphone achieves sensitivities of −64.3 dB (re: 1 V/Pa) in piezoelectric mode, −54.9 dB (re: 1 V/Pa) in capacitive mode, and −52.4 dB (re: 1 V/Pa) in hybrid mode, with corresponding SNR values of 65.7 dB, 59.8 dB, and 62.2 dB, respectively. To enhance the overall SNR of the hybrid MEMS microphone, a signal fusion technique is applied to the dual synchronized signals, resulting in an enhanced SNR of 66.7 dB, exhibiting a 14.1 dB improvement compared to the 52.6 dB reported in previous work. (Figure presented.)
AB - This work describes a hybrid micro-electro-mechanical-systems (MEMS) microphone integrating capacitive and piezoelectric transduction mechanisms for signal-to-noise ratio (SNR) improvement. A theoretical system-level model was established to characterize the hybrid device, which was fabricated using a silicon-on-insulator (SOI) wafer-based process. The piezoelectric transduction component employs a Si/SiO2/Au/AlN/Pt material stack, while the capacitive transduction part consists of a variable capacitor formed by a silicon handle layer and a silicon device layer. Experimental results at 1 kHz show that the hybrid MEMS microphone achieves sensitivities of −64.3 dB (re: 1 V/Pa) in piezoelectric mode, −54.9 dB (re: 1 V/Pa) in capacitive mode, and −52.4 dB (re: 1 V/Pa) in hybrid mode, with corresponding SNR values of 65.7 dB, 59.8 dB, and 62.2 dB, respectively. To enhance the overall SNR of the hybrid MEMS microphone, a signal fusion technique is applied to the dual synchronized signals, resulting in an enhanced SNR of 66.7 dB, exhibiting a 14.1 dB improvement compared to the 52.6 dB reported in previous work. (Figure presented.)
UR - https://www.scopus.com/pages/publications/105036439274
U2 - 10.1038/s41378-026-01251-y
DO - 10.1038/s41378-026-01251-y
M3 - 文章
AN - SCOPUS:105036439274
SN - 2055-7434
VL - 12
JO - Microsystems and Nanoengineering
JF - Microsystems and Nanoengineering
IS - 1
M1 - 136
ER -