TY - JOUR
T1 - 3D soft microbump electrodes for elastic interaction with brain tissue
AU - Ji, Bowen
AU - Sun, Fanqi
AU - Xue, Kai
AU - He, Sixuan
AU - Guo, Jiecheng
AU - You, Xiaoli
AU - Liu, Qing
AU - Jin, Minyi
AU - Bai, Ruiyu
AU - Wang, Xuanqi
AU - Liang, Zekai
AU - Li, Le
AU - Sun, Xun
AU - Guo, Jinku
AU - Hu, Huijing
AU - Wang, Minghao
AU - Chang, Honglong
N1 - Publisher Copyright:
© The Author(s) 2025.
PY - 2025/12
Y1 - 2025/12
N2 - Flexible implantable electrodes provide unprecedented opportunities for gentle mechanical interaction with soft neural tissues to acquire stable electrophysiological signals and reduce risk of tissue inflammatory response. Most electrocorticography (ECoG) electrodes adopt polymer film or silicone as substrate, with thickness sacrifice or poor micromachining precision, respectively. Besides, the distance of recessed electrode site to cortical surface leads to signal degradation. Here, we report a 3D polyimide-based electrode array on soft microbumps (height, 327 µm), with buffering contact capability and reliable mechanical strength that alleviates the mismatch from dental cement or cranial window. We demonstrate the reshaping processes of conventional 2D sites (diameter, 200 µm) into 3D protruding structure by stress-free preforming and silicone casting. The 3D soft microbump electrodes (SMBE) remain well undergoing whether cyclic voltammetry scanning or cyclic compression. The acute implanted SMBE array has shown sensitive response to whisker pulling and insusceptible stability by external force of anesthetic rats.
AB - Flexible implantable electrodes provide unprecedented opportunities for gentle mechanical interaction with soft neural tissues to acquire stable electrophysiological signals and reduce risk of tissue inflammatory response. Most electrocorticography (ECoG) electrodes adopt polymer film or silicone as substrate, with thickness sacrifice or poor micromachining precision, respectively. Besides, the distance of recessed electrode site to cortical surface leads to signal degradation. Here, we report a 3D polyimide-based electrode array on soft microbumps (height, 327 µm), with buffering contact capability and reliable mechanical strength that alleviates the mismatch from dental cement or cranial window. We demonstrate the reshaping processes of conventional 2D sites (diameter, 200 µm) into 3D protruding structure by stress-free preforming and silicone casting. The 3D soft microbump electrodes (SMBE) remain well undergoing whether cyclic voltammetry scanning or cyclic compression. The acute implanted SMBE array has shown sensitive response to whisker pulling and insusceptible stability by external force of anesthetic rats.
UR - https://www.scopus.com/pages/publications/105016798557
U2 - 10.1038/s41528-025-00480-x
DO - 10.1038/s41528-025-00480-x
M3 - 文章
AN - SCOPUS:105016798557
SN - 2397-4621
VL - 9
JO - npj Flexible Electronics
JF - npj Flexible Electronics
IS - 1
M1 - 96
ER -