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3D Cone-Shape Carbon Electrode Array for High-Fidelity Ecog Acquisition

  • Xuanqi Wang
  • , Xiaoli You
  • , Yong Yang
  • , Shouyan Li
  • , Yu Zhang
  • , Quetao Yu
  • , Chenfei Cao
  • , Feng Yue
  • , Honglong Chang
  • , Bowen Ji
  • Northwestern Polytechnical University Xian
  • Hainan University

科研成果: 书/报告/会议事项章节会议稿件同行评审

摘要

This work presents a three-dimensional cone-shaped carbon neural electrode array that achieves non-invasive, self-adaptive contact with the cortical surface. Using the ultraviolet laser processing, 3D conical microelectrodes and interconnects are patterned directly on a soft PDMS substrate, forming a conformal, mechanically compliant interface that enhances electrocorticography (ECoG) quality. The precise control of laser parameters enables tuning of cone height, thereby modulating cathodic charge storage capacity and impedance by multiple folds. To assess in vivo performance, 2D and 3D electrodes were implanted in the contralateral primary motor cortex (M1) of a rabbit and recorded simultaneously using a dual-array acquisition system. The 16-ch 3D electrodes exhibited impedance up to two orders of magnitude lower than that of 2D electrodes, together with higher amplitudes and reduced inter-trial variability. This soft 3D carbon electrode array provides a tissue-matched neural interface for robust, high-fidelity ECoG acquisition.

源语言英语
主期刊名2026 IEEE 39th International Conference on Micro Electro Mechanical Systems, MEMS 2026
出版商Institute of Electrical and Electronics Engineers Inc.
219-222
页数4
ISBN(电子版)9798331572518
DOI
出版状态已出版 - 2026
活动39th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2026 - Salzburg, 奥地利
期限: 25 1月 202629 1月 2026

出版系列

姓名Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN(印刷版)1084-6999

会议

会议39th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2026
国家/地区奥地利
Salzburg
时期25/01/2629/01/26

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