基于元件降额设计的温度步进强化试验剖面设计

Aiming at the problems of low efficiency and high cost of the enhanced test profile, a design framework for the temperature enhancement test profile of a certain missile electronics is proposed. Combined with the product reliability block diagram, the failure logic analysis of the test object is carried out. The step design method based on component derating (CD-SDM) optimizes the step size and shortens the test time, and the deterministic analysis method based on finite element simulation is used to obtain the working limit and the failure limit estimation, which reduce the influence of the working margin between the limits when the step size is divided and realize the optimization of step size, test time and other elements. Taking a high-temperature stepping test of a certain missile electronics as an example to verify the proposed method, the experimental results show that the temperature strengthening test profile obtained can be shortened by at least 13.33% in test time compared with the traditional methods, and the number of detection times is reduced by 1/4 compared with the traditional methods, which optimizes the problem of low efficiency and high cost of the current reliability enhancement test profile design for missile electronics.