@inproceedings{b04f691606594b8faf87309a01e2fc47,
title = "Ultrasoft Pit-Free Electrodes for High-SNR Neural Recordings",
abstract = "This paper reports an ultrasoft pit-free electrode array, aiming to reduce the 'electrode-tissue' distance during neural signal recordings. The pit-free electrode was obtained by the reversed fabrication processes of encapsulation-metal-substrate, which is different from the traditional substrate-metal-encapsulation sequence. The exposed metal electrode sites are coplanar with the polyimide encapsulation layer after released from silicon wafer. Besides, the pit-free electrode array is designed with serpentine shape and covered by mixed silicone on the back, so the array can be stretchable and conformal better with tissue surface. It has been proved in rabbit that the pit-free electrode can reduce the contact resistance and increase the signal noise ratio (SNR) during neural signal recordings.",
keywords = "Coplane, High SNR, Neural recordings, Pit-free electrodes, Ultrasoft substrate",
author = "Ruiyu Bai and Xuanqi Wang and Xiaoli You and Yong Yang and Yu Zhang and Quetao Yu and Chenfei Cao and Feng Yue and Minghao Wang and Yunlei Zhou and Honglong Chang and Bowen Ji",
note = "Publisher Copyright: {\textcopyright} 2026 IEEE.; 39th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2026 ; Conference date: 25-01-2026 Through 29-01-2026",
year = "2026",
doi = "10.1109/MEMS64181.2026.11419314",
language = "英语",
series = "Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "502--505",
booktitle = "2026 IEEE 39th International Conference on Micro Electro Mechanical Systems, MEMS 2026",
}