Ultra-fast photo-polymerized, flexible, durable electromagnetic wave absorbers for microelectronic devices

The widespread application of miniature, integrated flexible electronics in complex electromagnetic environments creates an urgent demand for novel flexible materials that also possess efficient electromagnetic wave (EMW) absorption capabilities. However, current flexible EMW absorbers remain constrained by processing methods, environmental stability, and particularly slow curing rates, making them unsuitable for precision patterning and micro-structure fabrication techniques. In this work, we developed a dual-phase photosensitive absorptive (DPA) gel exhibiting ultra-rapid ultraviolet light polymerization, which solidifies within 30 s. Owing to the molecular conformation differences between the two phases, the DPA gel forms a well-defined micro-phase-separated structure. This structure not only significantly enhances its mechanical properties but also introduces abundant heterogeneous interfaces that greatly increase polarization loss, leading to outstanding EMW absorption performance. Furthermore, microcircuits constructed from the DPA gel successfully achieve precise signal transmission. Moreover, the DPA gel exhibits a suite of advantageous properties, including environmental durability, freeze resistance, and thermal stability. This work provides a viable strategy for designing the new generation of flexible microelectronic devices with intrinsic EMW absorption capabilities.