Time-Dependent Evolution Study of Plasma-Treated Al Surface Enabling Two-Step Al-Al Direct Bonding in Ambient

Liangxing Hu; Huaiyun Fan; Xin Zhang; Yongfa Dong; Yaobin Li; Hesheng Tan; Yaqing Li; Huabing Deng; Yanyun Zhang; Nan Wang; Kai Tao

doi:10.1109/ICEPT67137.2025.11157112

Time-Dependent Evolution Study of Plasma-Treated Al Surface Enabling Two-Step Al-Al Direct Bonding in Ambient

Liangxing Hu
, Huaiyun Fan
, Xin Zhang
, Yongfa Dong
, Yaobin Li
, Hesheng Tan
, Yaqing Li
, Huabing Deng
, Yanyun Zhang
, Nan Wang
, Kai Tao

School of Mechanical Engineering

Kunming Institute of Physics
Nanyang Technological University
North Night Vision Technology Co. Ltd
Dalian University of Technology

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

In this paper, time-dependent evolution properties of Ar/N2 plasma-treated Al surface for two-step D2D Al-Al direct bonding in ambient is studied. Surface roughness is assessed on the Al surface both before and after plasma treatment, demonstrating that the plasma-treated Al surface remains as an "activated"status for up to ~6 hours compared to the as-deposited Al surface. The plasma-treated Al dies exposed in ambient for different durations are bonded in ambient environment, followed by batch annealing at 300°C. The bonded dies are examined for bonding microinterface quality, bonding strength, and hermeticity. The outcomes confirm successful bonding with the desired performances. This reported bonding technology would be a promising candidate for high-throughput heterogeneous integration and advanced packaging.

Original language	English
Title of host publication	2025 26th International Conference on Electronic Packaging Technology, ICEPT 2025
Publisher	Institute of Electrical and Electronics Engineers Inc.
Edition	2025
ISBN (Electronic)	9781665465809
DOIs	https://doi.org/10.1109/ICEPT67137.2025.11157112
State	Published - 2025
Event	26th International Conference on Electronic Packaging Technology, ICEPT 2025 - Shanghai, China Duration: 5 Aug 2025 → 7 Aug 2025

Conference

Conference	26th International Conference on Electronic Packaging Technology, ICEPT 2025
Country/Territory	China
City	Shanghai
Period	5/08/25 → 7/08/25

Keywords

aluminium-aluminium direct bonding
ambient conditions
plasma treatment
time-dependent evolution study

Access to Document

10.1109/ICEPT67137.2025.11157112

Cite this

Hu, L., Fan, H., Zhang, X., Dong, Y., Li, Y., Tan, H., Li, Y., Deng, H., Zhang, Y., Wang, N., & Tao, K. (2025). Time-Dependent Evolution Study of Plasma-Treated Al Surface Enabling Two-Step Al-Al Direct Bonding in Ambient. In 2025 26th International Conference on Electronic Packaging Technology, ICEPT 2025 (2025 ed.). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICEPT67137.2025.11157112

@inproceedings{5410587b61194ec597815fd743ef24ff,

title = "Time-Dependent Evolution Study of Plasma-Treated Al Surface Enabling Two-Step Al-Al Direct Bonding in Ambient",

abstract = "In this paper, time-dependent evolution properties of Ar/N2 plasma-treated Al surface for two-step D2D Al-Al direct bonding in ambient is studied. Surface roughness is assessed on the Al surface both before and after plasma treatment, demonstrating that the plasma-treated Al surface remains as an {"}activated{"}status for up to \textasciitilde{}6 hours compared to the as-deposited Al surface. The plasma-treated Al dies exposed in ambient for different durations are bonded in ambient environment, followed by batch annealing at 300°C. The bonded dies are examined for bonding microinterface quality, bonding strength, and hermeticity. The outcomes confirm successful bonding with the desired performances. This reported bonding technology would be a promising candidate for high-throughput heterogeneous integration and advanced packaging.",

keywords = "aluminium-aluminium direct bonding, ambient conditions, plasma treatment, time-dependent evolution study",

author = "Liangxing Hu and Huaiyun Fan and Xin Zhang and Yongfa Dong and Yaobin Li and Hesheng Tan and Yaqing Li and Huabing Deng and Yanyun Zhang and Nan Wang and Kai Tao",

note = "Publisher Copyright: {\textcopyright} 2025 IEEE.; 26th International Conference on Electronic Packaging Technology, ICEPT 2025 ; Conference date: 05-08-2025 Through 07-08-2025",

year = "2025",

doi = "10.1109/ICEPT67137.2025.11157112",

language = "英语",

booktitle = "2025 26th International Conference on Electronic Packaging Technology, ICEPT 2025",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

edition = "2025",

}

Hu, L, Fan, H, Zhang, X, Dong, Y, Li, Y, Tan, H, Li, Y, Deng, H, Zhang, Y, Wang, N & Tao, K 2025, Time-Dependent Evolution Study of Plasma-Treated Al Surface Enabling Two-Step Al-Al Direct Bonding in Ambient. in 2025 26th International Conference on Electronic Packaging Technology, ICEPT 2025. 2025 edn, Institute of Electrical and Electronics Engineers Inc., 26th International Conference on Electronic Packaging Technology, ICEPT 2025, Shanghai, China, 5/08/25. https://doi.org/10.1109/ICEPT67137.2025.11157112

Time-Dependent Evolution Study of Plasma-Treated Al Surface Enabling Two-Step Al-Al Direct Bonding in Ambient. / Hu, Liangxing; Fan, Huaiyun; Zhang, Xin et al.
2025 26th International Conference on Electronic Packaging Technology, ICEPT 2025. 2025. ed. Institute of Electrical and Electronics Engineers Inc., 2025.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Time-Dependent Evolution Study of Plasma-Treated Al Surface Enabling Two-Step Al-Al Direct Bonding in Ambient

AU - Hu, Liangxing

AU - Fan, Huaiyun

AU - Zhang, Xin

AU - Dong, Yongfa

AU - Li, Yaobin

AU - Tan, Hesheng

AU - Li, Yaqing

AU - Deng, Huabing

AU - Zhang, Yanyun

AU - Wang, Nan

AU - Tao, Kai

PY - 2025

Y1 - 2025

N2 - In this paper, time-dependent evolution properties of Ar/N2 plasma-treated Al surface for two-step D2D Al-Al direct bonding in ambient is studied. Surface roughness is assessed on the Al surface both before and after plasma treatment, demonstrating that the plasma-treated Al surface remains as an "activated"status for up to ~6 hours compared to the as-deposited Al surface. The plasma-treated Al dies exposed in ambient for different durations are bonded in ambient environment, followed by batch annealing at 300°C. The bonded dies are examined for bonding microinterface quality, bonding strength, and hermeticity. The outcomes confirm successful bonding with the desired performances. This reported bonding technology would be a promising candidate for high-throughput heterogeneous integration and advanced packaging.

AB - In this paper, time-dependent evolution properties of Ar/N2 plasma-treated Al surface for two-step D2D Al-Al direct bonding in ambient is studied. Surface roughness is assessed on the Al surface both before and after plasma treatment, demonstrating that the plasma-treated Al surface remains as an "activated"status for up to ~6 hours compared to the as-deposited Al surface. The plasma-treated Al dies exposed in ambient for different durations are bonded in ambient environment, followed by batch annealing at 300°C. The bonded dies are examined for bonding microinterface quality, bonding strength, and hermeticity. The outcomes confirm successful bonding with the desired performances. This reported bonding technology would be a promising candidate for high-throughput heterogeneous integration and advanced packaging.

KW - aluminium-aluminium direct bonding

KW - ambient conditions

KW - plasma treatment

KW - time-dependent evolution study

UR - https://www.scopus.com/pages/publications/105030954572

U2 - 10.1109/ICEPT67137.2025.11157112

DO - 10.1109/ICEPT67137.2025.11157112

M3 - 会议稿件

AN - SCOPUS:105030954572

BT - 2025 26th International Conference on Electronic Packaging Technology, ICEPT 2025

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 26th International Conference on Electronic Packaging Technology, ICEPT 2025

Y2 - 5 August 2025 through 7 August 2025

ER -

Time-Dependent Evolution Study of Plasma-Treated Al Surface Enabling Two-Step Al-Al Direct Bonding in Ambient

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