Abstract
Three-dimensional (3D) microstructures can clearly reveal the size, shape and distribution of the phases, providing a novel way to deeply understand the formation mechanism of the solidified phases. In this paper, by using the serial sectioning technique, the 3D microstructure of the primary Al 2Cu phase was reconstructed and the eutectic spacing adjustment was investigated during directional solidification of Al-40%Cu hypereutectic alloy. The results show that the primary Al 2Cu phase pattern was observed faceting due to the growing faceted angle and plane parallel to the solidification direction at the pulling rate of 5 μm/s. Further, there existed some hopper-like cavities in the 3D microstructure of the primary Al 2Cu phase that caused by remelting owing to a large amount of the latent heat difficult to be extracted from the solidification interface. For the 3D eutectic microstructures of the Al-40%Cu alloy, the growth direction of the Al and Al 2Cu phases in the coupled eutectics had a deviation angle of 5.1° with the heat flux direction and the phase volume fractions of the Al and Al 2Cu phases were measured directly to be 56.8% and 43.2%, respectively. In addition, at the abrupt change in pulling rate from 2 μm/s to 500 μm/s, the lamellar-to-rod eutectic transition was observed and the continuously splitting and branching occurred in different planes responsible for the eutectic spacing adjustment in the 3D microstructure of the Al-40%Cu alloy. Meanwhile the renuleation mechanism in the 2D microstructure for the adjustment of the eutectic spacing did not work in the 3D eutectic microstructure of the Al-40%Cu alloy.
| Original language | English |
|---|---|
| Pages (from-to) | 33-40 |
| Number of pages | 8 |
| Journal | Jinshu Xuebao/Acta Metallurgica Sinica |
| Volume | 48 |
| Issue number | 1 |
| DOIs | |
| State | Published - Jan 2012 |
Keywords
- Directional solidification
- Eutectic microstructure
- Primary Al Cu phase
- Serial sectioning technique
- Three-dimensional microstructure reconstruction
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