@inproceedings{c620f4de21374a668d0dedad8e8dd28d,
title = "Thermal cycling aging effects on the tensile property of lead-free solder Sn-3Ag-0.5Cu",
abstract = "Structural reliability issues attract more and more attentions with the rapid development of electronic packaging industry. Sn-Ag-Cu alloys have long been used as solder materials for the interconnections of microelectronic devices because of low melting temperature and good wettability. Many tensile tests were performed on Sn-3Ag-0.5Cu solder alloys at various strain rates and over a wide temperature range [1]. And thermal cycling aging studies on a lead-free Sn-Ag-Cu solder joint were investigated [2]. In this study, a series of tensile tests of Sn-3Ag-0.5Cu were investigated at different number of cycles and different temperatures. The possible mechanism of tensile strength, ductility improvement were discussed. The samples were placed in liquid nitrogen environment at 77 K for 10 minutes and then 293K(398K) for 10 minutes as one thermal cycle. The number of cycles is 5, 15, 25 and 35. Thermal cycling induces changes in properties.",
keywords = "lead-free solder, Sn-3Ag-0.5Cu, thermal cycling",
author = "Bingjie Chen and Kaimin Wang and Yao Yao",
note = "Publisher Copyright: {\textcopyright} 2017 IEEE.; 18th International Conference on Electronic Packaging Technology, ICEPT 2017 ; Conference date: 16-08-2017 Through 19-08-2017",
year = "2017",
month = sep,
day = "19",
doi = "10.1109/ICEPT.2017.8046548",
language = "英语",
series = "18th International Conference on Electronic Packaging Technology, ICEPT 2017",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "708--711",
editor = "Chenxi Wang and Yanhong Tian and Tianchun Ye",
booktitle = "18th International Conference on Electronic Packaging Technology, ICEPT 2017",
}