Abstract
Boron nitride (BN) micro particles modified by silane coupling agent, γ-aminopropyl triethoxy silane (KH550), are employed to prepare BN/epoxy resin (EP) thermal conductivity composites. The thermal conductivity coefficient of the composites with 60% mass fraction of modified BN is 1.052W/mK, five times higher than that of native EP (0.202W/mK). The mechanical properties of the composites are optimal with 10wt% BN. The thermal decomposition temperature, dielectric constant, and dielectric loss increase with the addition of BN. For a given BN loading, the surface modification of BN by KH550 exhibits a positive effect on the thermal conductivity and mechanical properties of the BN/EP composites.
| Original language | English |
|---|---|
| Pages (from-to) | 1025-1028 |
| Number of pages | 4 |
| Journal | Polymers for Advanced Technologies |
| Volume | 23 |
| Issue number | 6 |
| DOIs | |
| State | Published - Jun 2012 |
Keywords
- Boron nitride
- Epoxy resin
- Thermal conductivity
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