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The effect of grinding processing parameters on aspheric small-scale waviness

  • Qiancai Wei
  • , Lian Zhou
  • , Xianhua Chen
  • , Jie Li
  • , Qinghua Zhang
  • , Jian Wang
  • China Academy of Engineering Physics

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

3 Scopus citations

Abstract

Small scale waviness of aspheric surface inevitably occurs when grinding aspheric surface with grating parallel grinding technology, so aiming at the problem of waviness amplitude and uniformity, this paper theoretically analyses the relationship between grinding processing parameters and aspheric waviness, and designs a single factor experiment to verify the influence of grinding processing parameters on aspheric surface waviness. The processing parameters are determined to minimize the waviness amplitude. Considering the problem of uniformity of waviness, according to the influence of grinding force on uniformity of aspheric waviness in grinding process, down-grinding grating parallel grinding method and up-grinding grating parallel grinding method are used. Experiments verify that down-grinding grating parallel grinding method is the best method to get most uniformity small-scale waviness of aspheric surface. The minimum amplitude is 0.5μm∼1.5μm.

Original languageEnglish
Title of host publicationAOPC 2019
Subtitle of host publicationAI in Optics and Photonics
EditorsJohn Greivenkamp, Jun Tanida, Yadong Jiang, Haimei Gong, Jin Lu, Dong Liu
PublisherSPIE
ISBN (Electronic)9781510634565
DOIs
StatePublished - 2019
Externally publishedYes
EventApplied Optics and Photonics China 2019: AI in Optics and Photonics, AOPC 2019 - Beijing, China
Duration: 7 Jul 20199 Jul 2019

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume11342
ISSN (Print)0277-786X
ISSN (Electronic)1996-756X

Conference

ConferenceApplied Optics and Photonics China 2019: AI in Optics and Photonics, AOPC 2019
Country/TerritoryChina
CityBeijing
Period7/07/199/07/19

Keywords

  • Aspheric
  • Down-grinding
  • Parallel grinding technology
  • Processing parameters
  • Up-grinding
  • Waviness

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