The design of radiation resistant flip-flop unit based on commercial process

Radiation resistant chip based on commercial semiconductor process can be achieved by modifying the circuit diagram and the layout topology of a chip. In the paper, four technologies such as double interlock cell, Triple Modular Redundancy, and RC filter have been analyzed. Combining the four technologies, a novel radiation resistant D flip flop has been designed. At last, and simulation have been adopted to demonstrate the performance of its radiation resistivity.