Synthesis and properties of single-component epoxy adhesive containing microcapsule-type latent curing agent

You Qiang Shi; Qiu Yu Zhang; Shan He; Zhi Yong Wang; Yu Qi

doi:10.3969/j.issn.1001-4381.2013.11.006

Synthesis and properties of single-component epoxy adhesive containing microcapsule-type latent curing agent

You Qiang Shi, Qiu Yu Zhang, Shan He, Zhi Yong Wang, Yu Qi

School of Chemistry and Chemical Engineering

Beijing Institute of Aeronautical Materials

Research output: Contribution to journal › Article › peer-review

1 Scopus citations

Abstract

A novel single-component adhesive was successfully prepared with 2PZ-PGMA microcapsule-type latent curing agent as curing agent and epoxy resin as resin. The optimal composition, optimal curing process, curing characteristics, latent properties and mechanical properties of this single-component adhesive were researched by using DSC and mechanical testing machine. The results show that the one-component adhesive present excellent curing characteristics and latent properties. The E-51/PGMA microcapsule system can be cured at 100°C in 30min and its shelf life at room temperature is more than 50 days. In addition, the tensile shear strength, compressive strength and impact strength of its casting body are 15.36MPa, 170.67MPa and 5.13×10^-3kJ/m² respectively.

Original language	English
Pages (from-to)	32-37
Number of pages	6
Journal	Cailiao Gongcheng/Journal of Materials Engineering
Issue number	11
DOIs	https://doi.org/10.3969/j.issn.1001-4381.2013.11.006
State	Published - 2013

Keywords

Latent property
Microcapsule-type latent curing agent
Rapid repair
Single-component adhesive
Strengthening and toughening

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10.3969/j.issn.1001-4381.2013.11.006

Cite this

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title = "Synthesis and properties of single-component epoxy adhesive containing microcapsule-type latent curing agent",

abstract = "A novel single-component adhesive was successfully prepared with 2PZ-PGMA microcapsule-type latent curing agent as curing agent and epoxy resin as resin. The optimal composition, optimal curing process, curing characteristics, latent properties and mechanical properties of this single-component adhesive were researched by using DSC and mechanical testing machine. The results show that the one-component adhesive present excellent curing characteristics and latent properties. The E-51/PGMA microcapsule system can be cured at 100°C in 30min and its shelf life at room temperature is more than 50 days. In addition, the tensile shear strength, compressive strength and impact strength of its casting body are 15.36MPa, 170.67MPa and 5.13×10-3kJ/m2 respectively.",

keywords = "Latent property, Microcapsule-type latent curing agent, Rapid repair, Single-component adhesive, Strengthening and toughening",

author = "Shi, {You Qiang} and Zhang, {Qiu Yu} and Shan He and Wang, {Zhi Yong} and Yu Qi",

year = "2013",

doi = "10.3969/j.issn.1001-4381.2013.11.006",

language = "英语",

pages = "32--37",

journal = "Cailiao Gongcheng/Journal of Materials Engineering",

issn = "1001-4381",

publisher = "Science Press ",

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T1 - Synthesis and properties of single-component epoxy adhesive containing microcapsule-type latent curing agent

AU - Shi, You Qiang

AU - Zhang, Qiu Yu

AU - He, Shan

AU - Wang, Zhi Yong

AU - Qi, Yu

PY - 2013

Y1 - 2013

N2 - A novel single-component adhesive was successfully prepared with 2PZ-PGMA microcapsule-type latent curing agent as curing agent and epoxy resin as resin. The optimal composition, optimal curing process, curing characteristics, latent properties and mechanical properties of this single-component adhesive were researched by using DSC and mechanical testing machine. The results show that the one-component adhesive present excellent curing characteristics and latent properties. The E-51/PGMA microcapsule system can be cured at 100°C in 30min and its shelf life at room temperature is more than 50 days. In addition, the tensile shear strength, compressive strength and impact strength of its casting body are 15.36MPa, 170.67MPa and 5.13×10-3kJ/m2 respectively.

AB - A novel single-component adhesive was successfully prepared with 2PZ-PGMA microcapsule-type latent curing agent as curing agent and epoxy resin as resin. The optimal composition, optimal curing process, curing characteristics, latent properties and mechanical properties of this single-component adhesive were researched by using DSC and mechanical testing machine. The results show that the one-component adhesive present excellent curing characteristics and latent properties. The E-51/PGMA microcapsule system can be cured at 100°C in 30min and its shelf life at room temperature is more than 50 days. In addition, the tensile shear strength, compressive strength and impact strength of its casting body are 15.36MPa, 170.67MPa and 5.13×10-3kJ/m2 respectively.

KW - Latent property

KW - Microcapsule-type latent curing agent

KW - Rapid repair

KW - Single-component adhesive

KW - Strengthening and toughening

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Synthesis and properties of single-component epoxy adhesive containing microcapsule-type latent curing agent

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Keywords

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