Synergistic improvement in thermal conductivity of polyimide nanocomposite films using boron nitride coated copper nanoparticles and nanowires

Electronic devices are increasingly dense, underscoring the need for effective thermal management. A polyimide (PI) matrix nanocomposite film combining boron nitride (BN)-coated copper nanoparticles (CuNPs@BN) and nanowires (CuNWs@BN) was fabricated by a flexible and fast technique for enhanced thermal conductivity and the dielectric properties of nanocomposite films. The thermal conductivity of (CuNPs-CuNWs)@BN/PI composite comprising 10 wt % filler loading rose to 4.32 W/mK, indicating a nearly 24.1-fold increase relative to the value obtained for pure PI matrix. The relative permittivity and dielectric loss approximated 4.92 and 0.026 at 1 MHz, respectively. The results indicated that the surface modification of CuNPs and CuNWs by introducing a ceramic insulating layer BN effectively promoted the formation of thermal conductive networks of nanofillers in the PI matrix. This study enabled the identification of appropriate modifier fillers for polymer matrix nanocomposites to improve electronic applications.