Study on E-51/DDS system modified by silsesquioxane based on (3-glycidoxypropyl) trimethoxysilane

Hai Lin Liu; Xiao Yan Ma; Guo Zheng Liang; Ting Li Lu; Qiang Ge

Study on E-51/DDS system modified by silsesquioxane based on (3-glycidoxypropyl) trimethoxysilane

Hai Lin Liu, Xiao Yan Ma, Guo Zheng Liang, Ting Li Lu, Qiang Ge

School of Chemistry and Chemical Engineering

Northwestern Polytechnical University Xian

Research output: Contribution to journal › Article › peer-review

Abstract

The E-51 epoxy resin modified by adding 3-glycidoxypropyl polyhedral silsesquioxane cage and using equivalent 4,4'-diaminodiphenyl sulfone (DDS) as the curing agent were studied. The FTIR spectrum, gelation characteristics and differential scanning calorimetry (DSC) were used to study the curing behavior and kinetics of the composites. The mechanical properties of the systems were also considered. The results showed that the cured reaction had lower activation energy E_a=48.7 kJ/mol. The heat deformation temperature (HDT), thermal decomposition temperature and glass transition temperature (T_g) of the composite were 200°C, 442°C and 245°C, and were 31°C, 58°C and 20°C respectively higher than that of E-51/DDS system under the same curing condition. This composite had higher thermal residue, which can be as high as 25% at 800°C. The flexural and impact strength were basically unchanged at the same time.

Original language	English
Pages (from-to)	26-29+54
Journal	Cailiao Gongcheng/Journal of Materials Engineering
Issue number	4
State	Published - Apr 2005

Keywords

Cure
Epoxy
Silsesquioxane

Cite this

@article{b4a45c4784d246a8bd62060860d0f589,

title = "Study on E-51/DDS system modified by silsesquioxane based on (3-glycidoxypropyl) trimethoxysilane",

abstract = "The E-51 epoxy resin modified by adding 3-glycidoxypropyl polyhedral silsesquioxane cage and using equivalent 4,4'-diaminodiphenyl sulfone (DDS) as the curing agent were studied. The FTIR spectrum, gelation characteristics and differential scanning calorimetry (DSC) were used to study the curing behavior and kinetics of the composites. The mechanical properties of the systems were also considered. The results showed that the cured reaction had lower activation energy Ea=48.7 kJ/mol. The heat deformation temperature (HDT), thermal decomposition temperature and glass transition temperature (Tg) of the composite were 200°C, 442°C and 245°C, and were 31°C, 58°C and 20°C respectively higher than that of E-51/DDS system under the same curing condition. This composite had higher thermal residue, which can be as high as 25% at 800°C. The flexural and impact strength were basically unchanged at the same time.",

keywords = "Cure, Epoxy, Silsesquioxane",

author = "Liu, {Hai Lin} and Ma, {Xiao Yan} and Liang, {Guo Zheng} and Lu, {Ting Li} and Qiang Ge",

year = "2005",

month = apr,

language = "英语",

pages = "26--29+54",

journal = "Cailiao Gongcheng/Journal of Materials Engineering",

issn = "1001-4381",

publisher = "Science Press ",

number = "4",

}

TY - JOUR

T1 - Study on E-51/DDS system modified by silsesquioxane based on (3-glycidoxypropyl) trimethoxysilane

AU - Liu, Hai Lin

AU - Ma, Xiao Yan

AU - Liang, Guo Zheng

AU - Lu, Ting Li

AU - Ge, Qiang

PY - 2005/4

Y1 - 2005/4

N2 - The E-51 epoxy resin modified by adding 3-glycidoxypropyl polyhedral silsesquioxane cage and using equivalent 4,4'-diaminodiphenyl sulfone (DDS) as the curing agent were studied. The FTIR spectrum, gelation characteristics and differential scanning calorimetry (DSC) were used to study the curing behavior and kinetics of the composites. The mechanical properties of the systems were also considered. The results showed that the cured reaction had lower activation energy Ea=48.7 kJ/mol. The heat deformation temperature (HDT), thermal decomposition temperature and glass transition temperature (Tg) of the composite were 200°C, 442°C and 245°C, and were 31°C, 58°C and 20°C respectively higher than that of E-51/DDS system under the same curing condition. This composite had higher thermal residue, which can be as high as 25% at 800°C. The flexural and impact strength were basically unchanged at the same time.

AB - The E-51 epoxy resin modified by adding 3-glycidoxypropyl polyhedral silsesquioxane cage and using equivalent 4,4'-diaminodiphenyl sulfone (DDS) as the curing agent were studied. The FTIR spectrum, gelation characteristics and differential scanning calorimetry (DSC) were used to study the curing behavior and kinetics of the composites. The mechanical properties of the systems were also considered. The results showed that the cured reaction had lower activation energy Ea=48.7 kJ/mol. The heat deformation temperature (HDT), thermal decomposition temperature and glass transition temperature (Tg) of the composite were 200°C, 442°C and 245°C, and were 31°C, 58°C and 20°C respectively higher than that of E-51/DDS system under the same curing condition. This composite had higher thermal residue, which can be as high as 25% at 800°C. The flexural and impact strength were basically unchanged at the same time.

KW - Cure

KW - Epoxy

KW - Silsesquioxane

UR - http://www.scopus.com/inward/record.url?scp=19044368388&partnerID=8YFLogxK

M3 - 文章

AN - SCOPUS:19044368388

SN - 1001-4381

SP - 26-29+54

JO - Cailiao Gongcheng/Journal of Materials Engineering

JF - Cailiao Gongcheng/Journal of Materials Engineering

IS - 4

ER -

Study on E-51/DDS system modified by silsesquioxane based on (3-glycidoxypropyl) trimethoxysilane

Abstract

Keywords

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