Study of electroless Ni-Cu-P alloy plating on the glass fiber

The Ni-W-P coatings were deposited on the surface of glass fiber by electroless plating process to prepare a new microwave absorbing material. The bath was proved to be steady through the Palladium salt test. The morphology of the coatings were observed through the scanning electron microscope (SEM). The elements and their content were tested and analyzed through energy dispersive X-ray spectroscope (EDS). It was found that the bath is steady, deposits is continuous and uniform. There were no peeling and blistering on the surface of the Ni-Cu-P alloy glass fiber after the thermal shock test. It shows that the deposits have high strength of adhesion. The copper content in the coating is 12.99 wt% at most, and at that time, the resistance rate of the Ni-Cu-P alloy conducting glass fiber is 4 × 10^-4 Ω·cm. The electromagnetic parameters of the Ni-Cu-P alloy glass fiber were tested and analyzed primarily. The dielectric loss of the material is 0.825.