Structure and properties of composite Ni–Co–Mn coatings on metal interconnects by electrodeposition

Y. Shao, P. Y. Guo, H. Sun, T. C. Zhou, J. T. Ding, K. X. Xu, Y. X. Wang, Y. X. Guo, D. P. Wang, X. H. Hou

Research output: Contribution to journalArticlepeer-review

31 Scopus citations

Abstract

In order to obtain the high conductivity values and wide spinel stability region for solid oxide fuel cell interconnect, several multilayer Ni, Co and Mn coatings are electroplated and then oxidized in air to form spinel oxide layers. Potentiodynamic polarization curves in different simple solutions are tested to analyze the deposition behavior of Co and Mn. Microstructures and compositions of Ni–Co–Mn multi-layers by adjusting the thickness and deposition parameters are analyzed by X-ray diffraction (XRD) and scanning electron microscopy (SEM). The results show that area specific resistance value of sample B–Ni/Co after oxidation at 750 °C for 500h is the lowest among the coatings, and the resistance values at 700 °C and 800 °C are 35.3 and 31.7 mΩ‧cm2, respectively. When the Ni transition layer in the vicinity of coating/substrate interface is thick, it will lead to the outward diffusion and aggregation of element Fe to form Fe-rich oxide intermediate layer, which will affect the high-temperature performance of the coating. Pure Co and CoMn alloy coatings with a certain thickness can effectively prevent the inward diffusion of oxygen and the outward diffusion of Fe and Cr at high temperature. The thin Ni transition layer combined with the thick Co layer or CoMn layer has the best element diffusion inhibition and high temperature electrical properties during the long-term high-temperature oxidation process.

Original languageEnglish
Article number152006
JournalJournal of Alloys and Compounds
Volume811
DOIs
StatePublished - 30 Nov 2019
Externally publishedYes

Keywords

  • Electrodeposition
  • Multilayers
  • Ni–Co–Mn
  • Oxidation

Fingerprint

Dive into the research topics of 'Structure and properties of composite Ni–Co–Mn coatings on metal interconnects by electrodeposition'. Together they form a unique fingerprint.

Cite this