Abstract
The mismatch in sintering kinetics between different ceramics may cause camber or cracks in achieving chip multilayer composites. It is a challenge to find the solution to eliminate the camber or cracks in co-fired composites without the degradation. To solve this problem, a novel zero-shrinkage-difference technique is introduced. According to this philosophy, the sandwich structure of ZMT3 dielectric/NZC ferrite multilayer composite is designed, which shows no camber and cracks after being co-sintered. Due to their dielectric performance, low firing characteristics, and realizable co-firing compatibility, the sandwich structure of ZMT3 dielectric/NZC ferrite multilayer composite can serve as the promising medium materials in the multilayer LC filter.
| Original language | English |
|---|---|
| Pages (from-to) | 743-746 |
| Number of pages | 4 |
| Journal | Journal of Alloys and Compounds |
| Volume | 486 |
| Issue number | 1-2 |
| DOIs | |
| State | Published - 3 Nov 2009 |
Keywords
- Electrical properties
- Interface
- Layered structures
- Sandwich
- Sintering
Fingerprint
Dive into the research topics of 'Sandwich layer composite prepared by a novel zero-shrinkage-difference technology'. Together they form a unique fingerprint.Cite this
- APA
- Author
- BIBTEX
- Harvard
- Standard
- RIS
- Vancouver