Research status on interface bonding mechanisms and strength of cold pressure welding

Solid state welding (SSW) has been increasingly applied in advanced metallic materials because of its outstanding advantages. Cold pressure welding(CPW), as a special SSW process, its interface bonding mechanisms and strength prediction are two difficult problems that have been puzzled the researchers for a long time. This paper reviewed the research status on the interface bonding mechanisms of CPW, emphatically discussed the influencing factors and prediction models of the interface bonding strength of CPW. It is pointed out that further research work on interface bonding mechanisms should overall consider the influences caused by diffusion, recrystallization and dislocation, while, building interface bonding strength models should overall consider the functions of deformation degree, deformation velocity and deformation temperature.