TY - JOUR
T1 - Research on optical transmittance and electromagnetic shielding effectiveness of TiO2/Cu/TiO2 multilayer film
AU - Lu, Linlin
AU - Yang, Zhenghua
AU - Xu, Jie
AU - Dong, Jie
N1 - Publisher Copyright:
© The Author(s), under exclusive licence to Springer Science+Business Media, LLC, part of Springer Nature 2025.
PY - 2025/1
Y1 - 2025/1
N2 - TiO2/Cu/TiO2 multilayer films were prepared on quartz glass by magnetron sputtering, and the effects of Cu film thickness on the electrical, optical and electromagnetic shielding performance of TiO2/Cu/TiO2 multilayer films were investigated. The results show that with the increase of Cu film thickness from 14 to 34 nm, the square resistance of TiO2/Cu/TiO2 multilayer films gradually decreases from 13.1 to 3.29 Ω, and the average visible light transmittance of the multilayer films drops from 80.2% to 66.0%. With the increase of Cu film thicknesses, electromagnetic shielding performance of TiO2/Cu/TiO2 multilayer films exhibits an upward trend. The total electromagnetic shielding effectiveness (SET) of TiO2/Cu/TiO2 multilayer film (30/34/30 nm thick) reaches the maximum, and the SET value of the multilayer film exceeds 19 dB.
AB - TiO2/Cu/TiO2 multilayer films were prepared on quartz glass by magnetron sputtering, and the effects of Cu film thickness on the electrical, optical and electromagnetic shielding performance of TiO2/Cu/TiO2 multilayer films were investigated. The results show that with the increase of Cu film thickness from 14 to 34 nm, the square resistance of TiO2/Cu/TiO2 multilayer films gradually decreases from 13.1 to 3.29 Ω, and the average visible light transmittance of the multilayer films drops from 80.2% to 66.0%. With the increase of Cu film thicknesses, electromagnetic shielding performance of TiO2/Cu/TiO2 multilayer films exhibits an upward trend. The total electromagnetic shielding effectiveness (SET) of TiO2/Cu/TiO2 multilayer film (30/34/30 nm thick) reaches the maximum, and the SET value of the multilayer film exceeds 19 dB.
UR - http://www.scopus.com/inward/record.url?scp=85217739631&partnerID=8YFLogxK
U2 - 10.1007/s10854-024-14199-4
DO - 10.1007/s10854-024-14199-4
M3 - 文章
AN - SCOPUS:85217739631
SN - 0957-4522
VL - 36
JO - Journal of Materials Science: Materials in Electronics
JF - Journal of Materials Science: Materials in Electronics
IS - 2
M1 - 113
ER -