Reduced Graphene Oxide Heterostructured Silver Nanoparticles Significantly Enhanced Thermal Conductivities in Hot-Pressed Electrospun Polyimide Nanocomposites

Graphene presents an extremely ultra-high thermal conductivity, well above other known thermally conductive fillers. However, graphene tends to aggregate easily due to its strong intermolecular π-πinteraction, resulting in poor dispersion in the polymer matrix. In this study, silver nanoparticles anchored reduced graphene oxide (Ag/rGO) were first prepared using one-pot synchronous reduction of Ag⁺ and GO solution via glucose. The thermally conductive (Ag/rGO)/polyimide ((Ag/rGO)/PI) nanocomposites were then obtained via electrospinning the in situ polymerized (Ag/rGO)/polyamide electrospun suspension followed by a hot-press technique. The thermal conductivity (λ), glass transition temperature (T_g), and heat resistance index (T_HRI) of the (Ag/rGO)/PI nanocomposites all increased with increasing the loading of Ag/rGO fillers. When the mass fraction of Ag/rGO (the weight ratio of rGO to Ag was 4:1) fillers was 15%, the corresponding (Ag/rGO)/PI nanocomposites showed a maximum λ of 2.12 W/(m K). The corresponding T_g and T_HRI values were also enhanced to 216.1 and 298.6 °C, respectively. Furthermore, thermal conductivities calculated by our established improved thermal conduction model were relatively closer to the experimental results than the results obtained from other classical models.