Rapid growth kinetics of intermetallic Ni3Ti compound under electrostatic levitation state

  • L. Wang
  • , L. Hu
  • , D. L. Geng
  • , B. Wei

Research output: Contribution to journalArticlepeer-review

3 Scopus citations

Abstract

The rapid solidification mechanism of Ni3Ti intermetallic compound within undercooled Ni75Ti25 and Ni74Ti18Al8 alloys was investigated by electrostatic levitation(ESL) and liquid quenching(LQ) techniques. The dendritic growth velocity of Ni3Ti phase in these two alloys revealed power law relations versus liquid undercooling, whose maximum value was 138.9 mm s−1 for binary Ni75Ti25 alloy at 255 K(0.15TL) undercooling, while it was only 54.7 mm s−1 at 222 K(0.13TL) undercooling for ternary Ni74Ti18Al8 alloy. The crystalline structure of Ni3Ti phase in both alloys was characterized by fine dendrites under LQ state, whereas it displayed faceted growth mode under ESL condition. In addition, the Ni3Ti grains of Ni75Ti25 alloy show a transition from incompletely to completely surrounded by the grain boundaries.

Original languageEnglish
Pages (from-to)290-293
Number of pages4
JournalMaterials Letters
Volume254
DOIs
StatePublished - 1 Nov 2019

Keywords

  • Dendrite growth
  • Electrostatic levitation
  • Intermetallic alloys and compounds
  • Microstructure

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