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Properties of polyurethane-modified epoxy resin encapsulating materials filled with glass fiber

  • Zhi Hua Li
  • , Wei Lin
  • , Ke Yu Xie
  • , Zi Qiao Zheng
  • Central South University

Research output: Contribution to journalArticlepeer-review

2 Scopus citations

Abstract

With polyurethane modification of diglycidyl-4, 5-epoxycyclohexane-1, 2-dicarboxylate (TDE-85), tetrahydrocannabinol glycidyl phthalate (711) and phenol-based epoxy propane (E-51), three epoxy resin encapsulating materials of MG/PU/TDE-85, MG/PU/711 and MG/PU/E-51 were prepared by the reinforcement of milled glass fiber(MG) and vaccum priming. The mechanical properties, thermal properties and electrical properties of these encapsulating materials were studied. The results indicate that MG/PU/TDE-85 has the best integrated properties. The properties of MG/PU/TDE-85 are all better than the other two with the tensile strength of 79.72 MPa, impact strength of 17.83 kJ/m2, glass transition temperature of 144°C and the volume resistance of 2.78×1015 Ω·cm.

Original languageEnglish
Pages (from-to)47-49
Number of pages3
JournalGaofenzi Cailiao Kexue Yu Gongcheng/Polymeric Materials Science and Engineering
Volume25
Issue number9
StatePublished - Sep 2009
Externally publishedYes

Keywords

  • Encapsulating material
  • Epoxy resin
  • Milled glass fiber
  • Polyurethane(PU)
  • Properties

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