Abstract
The bisphenol A epoxy resin (E-51) / 4,4'- diaminodiphenyl sulfone (DDS) was modified by the epoxy silsesquioxane (EPb-POSS), which was synthesized by hydrolytic condensation of (γ-glycidoxypropyl)trimethoxysilane under basic condition, to prepare EPb-POSS/E-51/DDS modified resin systems. The curing process and the influence of EPb-POSS with different contents on the mechanical properties and thermal stability of the modified resin systems was studied. The results show that although the EPb-POSS have little effect on the curing process and the stiffness of the modified resin, it can significantly improve the toughness; when the mass fraction of EPb-POSS is 1.0%, the impact strength of the modified resin can reach 49.2kJ·m2, is increased by 90.0%, and shows obvious toughness fracture; the bending strength is 132.8MPa, is slightly increased; and the initial decomposition temperature is 378.0℃, is increased by 26.0℃.
| Original language | English |
|---|---|
| Pages (from-to) | 33-38 |
| Number of pages | 6 |
| Journal | Cailiao Gongcheng/Journal of Materials Engineering |
| Volume | 44 |
| Issue number | 11 |
| DOIs | |
| State | Published - 20 Nov 2016 |
Keywords
- Epoxy resin
- Silsesquioxane
- Thermal stability
- Toughness
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