Abstract
A novel heat released microcapsule-type latent curing agent was prepared by solvent evaporation technique with 2-methylimidazole(2MMZ) as core material and polystyrene(PS) as wall material. The chemical structure, core material content, surface morphology, size distribution and curing characteristics of this microcapsule-type curing agent were characterized by FT-IR, TGA, SEM, granulometer and DSC. The obtained microcapsules had a smooth surface and displayed a narrow size distribution with the mean size about 10.18 μm, and its core material content was about 40.36%. In addition, the one-component adhesive made from the microcapsules and epoxy resin E-51 showed excellent curing characteristics and latent properties. It was found that the E-51/2MMZ-PS microcapsule system could be cured at 100°C in 1 h and its shelf life at room temperature was more than 1 month.
| Original language | English |
|---|---|
| Pages (from-to) | 2651-2656 |
| Number of pages | 6 |
| Journal | Huagong Xuebao/Journal of Chemical Industry and Engineering (China) |
| Volume | 62 |
| Issue number | 9 |
| DOIs | |
| State | Published - Sep 2011 |
Keywords
- Epoxy resin
- Latent curing agent
- Microcapsule
- Solvent volatilization method
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