TY - JOUR
T1 - Nanoporous modified Ni3Sn4 intermetallics nanoarrays for enhanced alkaline hydrogen evolution catalysts
AU - Qian, Jin
AU - Bo, Yunfei
AU - Huang, Hao
AU - Dan, Zhenhua
AU - Zhou, Lian
N1 - Publisher Copyright:
© 2025 Elsevier B.V.
PY - 2026/2/1
Y1 - 2026/2/1
N2 - A stepwise fabrication strategy is developed to construct high-surface-area Ni-rich nanoporous layer covered Ni3Sn4 intermetallic nanoarrays. This process involves surface alloying in molten Sn at 300 °C, followed by sequential chemical and electrochemical dealloying in 0.1 M HCl. During surface alloying, Ni3Sn4 intermetallic phases grow via grain boundary diffusion and grooving, forming a dense interlayer at the Ni/Sn interface. After 4 h chemical dealloying, well-aligned and pillar-shaped Ni3Sn4 nanoarrays with an average diameter of ∼237 nm remain anchored on the unreacted Ni cores. Prolonged dealloying leads to the dissolution and collapse of these nanoarrays. The formation mechanism is attributed to the selective dissolution of micro-coupling of embedded Sn within the Sn-alloyed shells and Ni3Sn4 phases. Subsequent electrochemical dealloying, as nanoporous modification of Ni3Sn4 intermetallics nanoarrays, induces Sn leaching, producing Ni-rich nanoporous layers and resulting in 4-fold increase in the surface area. The final catalyst exhibited an overpotential of 244 mV at 10 mA cm−2 and a Tafel slope of 86.2 mV dec−1, with minimal degradation (69 mV negative shift, <30 mV dec−1 decay) after 5000 LSV cycles. Compared to pure Ni and other NiSn-based catalysts, the Ni-rich porous Ni3Sn4 intermetallics nanoarrays exhibit superior HER Kinetics and long-term electrochemical stability. This stepwise surface roughening approach offers an effective route to enhance catalytic performance of metallic wires and porous metals.
AB - A stepwise fabrication strategy is developed to construct high-surface-area Ni-rich nanoporous layer covered Ni3Sn4 intermetallic nanoarrays. This process involves surface alloying in molten Sn at 300 °C, followed by sequential chemical and electrochemical dealloying in 0.1 M HCl. During surface alloying, Ni3Sn4 intermetallic phases grow via grain boundary diffusion and grooving, forming a dense interlayer at the Ni/Sn interface. After 4 h chemical dealloying, well-aligned and pillar-shaped Ni3Sn4 nanoarrays with an average diameter of ∼237 nm remain anchored on the unreacted Ni cores. Prolonged dealloying leads to the dissolution and collapse of these nanoarrays. The formation mechanism is attributed to the selective dissolution of micro-coupling of embedded Sn within the Sn-alloyed shells and Ni3Sn4 phases. Subsequent electrochemical dealloying, as nanoporous modification of Ni3Sn4 intermetallics nanoarrays, induces Sn leaching, producing Ni-rich nanoporous layers and resulting in 4-fold increase in the surface area. The final catalyst exhibited an overpotential of 244 mV at 10 mA cm−2 and a Tafel slope of 86.2 mV dec−1, with minimal degradation (69 mV negative shift, <30 mV dec−1 decay) after 5000 LSV cycles. Compared to pure Ni and other NiSn-based catalysts, the Ni-rich porous Ni3Sn4 intermetallics nanoarrays exhibit superior HER Kinetics and long-term electrochemical stability. This stepwise surface roughening approach offers an effective route to enhance catalytic performance of metallic wires and porous metals.
KW - Double dealloying
KW - Hydrogen evolution catalyst
KW - NiSn intermetallics nanoarrays
KW - Surface alloying
KW - Surface roughening
UR - https://www.scopus.com/pages/publications/105023590279
U2 - 10.1016/j.matchemphys.2025.131852
DO - 10.1016/j.matchemphys.2025.131852
M3 - 文章
AN - SCOPUS:105023590279
SN - 0254-0584
VL - 349
JO - Materials Chemistry and Physics
JF - Materials Chemistry and Physics
M1 - 131852
ER -