Multilayer Device-Level Electro-Thermal Real-Time Simulation and Multipurpose HIL Testing of Power Electronics Converters

Real-time simulation (RTS) of power electronic converters (PECs) has become increasingly crucial throughout their lifecycle in modern electrified transportation systems, yet remains constrained by computational limitations. This article presents a multilayer device-level electrothermal RTS methodology that simultaneously addresses electrical-thermal coupling effects and semiconductor switching characteristics while maintaining computational efficiency. A novel multipurpose hardware-in-the-loop (HIL) testing framework is subsequently developed by systematically integrating the proposed electrothermal RTS, enhancing both functional verification capabilities and testing efficiency. Experimental validation is conducted through an field programmable gate array (FPGA)-based implementation for an interleaved bidirectional DC-DC converter. The real-time simulation results demonstrate high consistency compared to offline LTspice simulations. Successful integration with the HIL testing confirms the methodology's effectiveness in enabling concurrent electro-thermal analysis and control strategy verification, significantly advancing the development of reliable PECs for electrified transportation.