Multi-Layer Device-Level Electro-Thermal Real-Time Simulation and Multi-Purpose HIL Testing of Power Electronics Converters

Real-time simulation (RTS) of power electronic converters (PECs) has become increasingly crucial throughout their lifecycle in modern electrified transportation systems, yet remains constrained by computational limitations. This paper presents a multi-layer device-level electro-thermal RTS methodology that simultaneously addresses electrical-thermal coupling effects and semiconductor switching characteristics while maintaining computational efficiency. A novel multi-purpose hardware-in-the-loop (HIL) testing framework is subsequently developed by systematically integrating the proposed electro-thermal RTS, enhancing both functional verification capabilities and testing efficiency. Experimental validation is conducted through an FPGA-based implementation for an interleaved bidirectional DC-DC converter. The real-time simulation results demonstrate high consistency compared to offline LTspice simulations. Successful integration with the HIL testing confirms the methodology's effectiveness in enabling concurrent electro-thermal analysis and control strategy verification, significantly advancing the development of reliable PECs for electrified transportation.