Microstructure and properties of high strength and high conductivity Cu-Nb microcomposite

Ming Liang; Zili Chen; Yafeng Lu; Chenshan Li; Guo Yan; Jinshan Li; Pingxiang Zhang

Microstructure and properties of high strength and high conductivity Cu-Nb microcomposite

Ming Liang
, Zili Chen
, Yafeng Lu
, Chenshan Li
, Guo Yan
, Jinshan Li
, Pingxiang Zhang

School of Materials Sience and Engineering

Northwestern Polytechnical University Xian
Northwest Institute for Nonferrous Metal Research

Research output: Contribution to journal › Article › peer-review

8 Scopus citations

Abstract

Cu-Nb microcomposite wire materials containing N=85⁴ niobium filaments were prepared by bundling and drawing technique. The electrical resistivity of the materials is 0.36 μΩ·cm at 77 K. The conductivity values could be greater than 70%IACS at 293 K. The ultimate tensile strength could reach 915 MPa at room temperature when the sectional area of the materials was larger than 5 mm². And the fracture surface morphology and the Nb filaments arrangement of Cu-Nb wires were observed by SEM.

Original language	English
Pages (from-to)	1774-1777
Number of pages	4
Journal	Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering
Volume	38
Issue number	10
State	Published - Oct 2009

Keywords

Bundling and drawing process
Cu-Nb
Electrical resistivity
Tensile strength

Cite this

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title = "Microstructure and properties of high strength and high conductivity Cu-Nb microcomposite",

abstract = "Cu-Nb microcomposite wire materials containing N=854 niobium filaments were prepared by bundling and drawing technique. The electrical resistivity of the materials is 0.36 μΩ·cm at 77 K. The conductivity values could be greater than 70\%IACS at 293 K. The ultimate tensile strength could reach 915 MPa at room temperature when the sectional area of the materials was larger than 5 mm2. And the fracture surface morphology and the Nb filaments arrangement of Cu-Nb wires were observed by SEM.",

keywords = "Bundling and drawing process, Cu-Nb, Electrical resistivity, Tensile strength",

author = "Ming Liang and Zili Chen and Yafeng Lu and Chenshan Li and Guo Yan and Jinshan Li and Pingxiang Zhang",

year = "2009",

month = oct,

language = "英语",

volume = "38",

pages = "1774--1777",

journal = "Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering",

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number = "10",

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TY - JOUR

T1 - Microstructure and properties of high strength and high conductivity Cu-Nb microcomposite

AU - Liang, Ming

AU - Chen, Zili

AU - Lu, Yafeng

AU - Li, Chenshan

AU - Yan, Guo

AU - Li, Jinshan

AU - Zhang, Pingxiang

PY - 2009/10

Y1 - 2009/10

N2 - Cu-Nb microcomposite wire materials containing N=854 niobium filaments were prepared by bundling and drawing technique. The electrical resistivity of the materials is 0.36 μΩ·cm at 77 K. The conductivity values could be greater than 70%IACS at 293 K. The ultimate tensile strength could reach 915 MPa at room temperature when the sectional area of the materials was larger than 5 mm2. And the fracture surface morphology and the Nb filaments arrangement of Cu-Nb wires were observed by SEM.

AB - Cu-Nb microcomposite wire materials containing N=854 niobium filaments were prepared by bundling and drawing technique. The electrical resistivity of the materials is 0.36 μΩ·cm at 77 K. The conductivity values could be greater than 70%IACS at 293 K. The ultimate tensile strength could reach 915 MPa at room temperature when the sectional area of the materials was larger than 5 mm2. And the fracture surface morphology and the Nb filaments arrangement of Cu-Nb wires were observed by SEM.

KW - Bundling and drawing process

KW - Cu-Nb

KW - Electrical resistivity

KW - Tensile strength

UR - https://www.scopus.com/pages/publications/70749088877

M3 - 文章

AN - SCOPUS:70749088877

SN - 1002-185X

VL - 38

SP - 1774

EP - 1777

JO - Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering

JF - Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering

IS - 10

ER -

Microstructure and properties of high strength and high conductivity Cu-Nb microcomposite

Abstract

Keywords

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