Microstructure and properties of diamond/SiC composites prepared by tape-casting and chemical vapor infiltration process

Yongsheng Liu, Chenghao Hu, Wei Feng, Jing Men, Laifei Cheng, Litong Zhang

Research output: Contribution to journalArticlepeer-review

55 Scopus citations

Abstract

This article reported a novel method for preparing diamond/SiC composites by tape-casting and chemical vapor infiltration (CVI) process, and the advantages of this method were discussed. The diamond particle was proved to be thermally stable under CVI conditions and the CVI diamond/SiC composites only contained diamond and CVI-SiC phases. The SEM and TEM results showed a strong interfacial bonding existed between diamond and CVI-SiC matrix. Due to the strong bonding, the surface HRA hardness could reach up to 98.4 (HV 50±5GPa) and the thermal conductivity (TC) of composites was five times higher than that of pure CVI-SiC matrix. Additionally, the effects of diamond particle size on microstructure and properties of composites were also investigated. With the increasing of particle size, the density and TC of composites with the size 27μm reached 2.940g/cm3 and 82W/(mK), respectively.

Original languageEnglish
Pages (from-to)3489-3498
Number of pages10
JournalJournal of the European Ceramic Society
Volume34
Issue number15
DOIs
StatePublished - Dec 2014

Keywords

  • CVI
  • Diamond/SiC composites
  • Mechanical and thermal properties
  • Tape-casting

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