TY - JOUR
T1 - Microstructure and properties of bulk ultrafine-grained Cu1.5Cr0.1Si alloy through ECAP by route C and aging treatment
AU - Guo, Tingbiao
AU - Tai, Xiaoyang
AU - Wei, Shiru
AU - Wang, Junjie
AU - Jia, Zhi
AU - Ding, Yutian
N1 - Publisher Copyright:
© 2020 by the authors. Licensee MDPI, Basel, Switzerland.
PY - 2020/3
Y1 - 2020/3
N2 - The evolutions of the microstructure and its effect on the mechanical and electrical conductivity properties of Cu1.5Cr0.1Si alloy after equal channel angle pressing (ECAP)-C path deformation and aging treatment have been investigated using scanning electron microscopy (SEM), x-ray diffraction (XRD), and electron back-scattered diffraction (EBSD). It was found that after the ECAP-C deformation at room temperature, with an extension of aging time, the strong (111) macro orientation formed in the Cu1.5Cr0.1Si alloy. The ultrafine crystals formed by ECAP and the rich chromium phase precipitated along grain boundaries during the aging process greatly improved the material strength. After aging at 350 °C for 4 h, the tensile strength, elongation, and conductivity reached 528 MPa, 15.27%, and 78.9% IACS, respectively. The fracture mode of the alloy was ductile fracture. The steady-oriented {111} <110> texture was beneficial to improving the conductivity of the material.
AB - The evolutions of the microstructure and its effect on the mechanical and electrical conductivity properties of Cu1.5Cr0.1Si alloy after equal channel angle pressing (ECAP)-C path deformation and aging treatment have been investigated using scanning electron microscopy (SEM), x-ray diffraction (XRD), and electron back-scattered diffraction (EBSD). It was found that after the ECAP-C deformation at room temperature, with an extension of aging time, the strong (111) macro orientation formed in the Cu1.5Cr0.1Si alloy. The ultrafine crystals formed by ECAP and the rich chromium phase precipitated along grain boundaries during the aging process greatly improved the material strength. After aging at 350 °C for 4 h, the tensile strength, elongation, and conductivity reached 528 MPa, 15.27%, and 78.9% IACS, respectively. The fracture mode of the alloy was ductile fracture. The steady-oriented {111} <110> texture was beneficial to improving the conductivity of the material.
KW - Cu1.5Cr0.1Si alloy
KW - Electron back-scattered diffraction (EBSD)
KW - Equal channel angle pressing (ECAP)
KW - Microstructure texture
UR - http://www.scopus.com/inward/record.url?scp=85081702728&partnerID=8YFLogxK
U2 - 10.3390/cryst10030207
DO - 10.3390/cryst10030207
M3 - 文章
AN - SCOPUS:85081702728
SN - 2073-4352
VL - 10
JO - Crystals
JF - Crystals
IS - 3
M1 - 207
ER -