Micro pressure sensor array used to detect boundary-layer separation point

Shuang Chen; Mingquan Zhu; Jinjun Deng; Binghe Ma; Chengyu Jiang

Micro pressure sensor array used to detect boundary-layer separation point

Shuang Chen
, Mingquan Zhu
, Jinjun Deng
, Binghe Ma
, Chengyu Jiang

School of Microelectronics

Northwestern Polytechnical University Xian

Research output: Contribution to journal › Article › peer-review

Abstract

This paper discussed a measuring method of boundary-layer separation point which based on the change of surface static pressure distribution, and proposed a design of flexible substrate based micro pressure sensor array. This array can achieve real-time online measuring of non-planar surface. This design proposal of micro pressure sensor array can effectively meeting the measuring requirement of boundary-layer separation point, and expand engineering applied scope of MEMS devices.

Original language	English
Pages (from-to)	148-150
Number of pages	3
Journal	Zhongguo Jixie Gongcheng/China Mechanical Engineering
Volume	16
Issue number	SUPPL.
State	Published - Jul 2005

Keywords

Backside wire bonding
Boundary layer
Flexible substrate
Micro pressure sensor array
Separation point
Surface pressure distribution

Cite this

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title = "Micro pressure sensor array used to detect boundary-layer separation point",

abstract = "This paper discussed a measuring method of boundary-layer separation point which based on the change of surface static pressure distribution, and proposed a design of flexible substrate based micro pressure sensor array. This array can achieve real-time online measuring of non-planar surface. This design proposal of micro pressure sensor array can effectively meeting the measuring requirement of boundary-layer separation point, and expand engineering applied scope of MEMS devices.",

keywords = "Backside wire bonding, Boundary layer, Flexible substrate, Micro pressure sensor array, Separation point, Surface pressure distribution",

author = "Shuang Chen and Mingquan Zhu and Jinjun Deng and Binghe Ma and Chengyu Jiang",

year = "2005",

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language = "英语",

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AU - Chen, Shuang

AU - Zhu, Mingquan

AU - Deng, Jinjun

AU - Ma, Binghe

AU - Jiang, Chengyu

PY - 2005/7

Y1 - 2005/7

N2 - This paper discussed a measuring method of boundary-layer separation point which based on the change of surface static pressure distribution, and proposed a design of flexible substrate based micro pressure sensor array. This array can achieve real-time online measuring of non-planar surface. This design proposal of micro pressure sensor array can effectively meeting the measuring requirement of boundary-layer separation point, and expand engineering applied scope of MEMS devices.

AB - This paper discussed a measuring method of boundary-layer separation point which based on the change of surface static pressure distribution, and proposed a design of flexible substrate based micro pressure sensor array. This array can achieve real-time online measuring of non-planar surface. This design proposal of micro pressure sensor array can effectively meeting the measuring requirement of boundary-layer separation point, and expand engineering applied scope of MEMS devices.

KW - Backside wire bonding

KW - Boundary layer

KW - Flexible substrate

KW - Micro pressure sensor array

KW - Separation point

KW - Surface pressure distribution

UR - https://www.scopus.com/pages/publications/23744442369

M3 - 文章

AN - SCOPUS:23744442369

SN - 1004-132X

VL - 16

SP - 148

EP - 150

JO - Zhongguo Jixie Gongcheng/China Mechanical Engineering

JF - Zhongguo Jixie Gongcheng/China Mechanical Engineering

IS - SUPPL.

ER -

Micro pressure sensor array used to detect boundary-layer separation point

Abstract

Keywords

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