Abstract
Ultraviolet (UV) imprint lithography plays an important role in the electronic information field as a form of microstructure molding. Herein, a novel photoresist with an extremely low volume shrinkage (1.17%) and excellent degradation ability was developed for UV imprint lithography based on biorenewable cardanol, epoxy soybean oil, and tripropylene glycol diacrylate via combined free radical/cationic dual curing. The viscosity of modified cardanol was only one-seventh that of epoxy soybean oil and can be used as an excellent reactive diluent. The initiation efficiency and cross-linking density were significantly improved, showing an outstanding thermal stability (T5% of 312.8 °C), excellent adhesion (3.9 MPa), and high gel content (92.7%). More importantly, the photoresist manifested an excellent pattern transfer ability, and the adhesive displayed an excellent removability from the mold by introducing zinc acetyl acetone. This work provides a promising route to produce a high-performance photoresist with biomass derivatives.
| Original language | English |
|---|---|
| Pages (from-to) | 3600-3607 |
| Number of pages | 8 |
| Journal | Industrial and Engineering Chemistry Research |
| Volume | 63 |
| Issue number | 8 |
| DOIs | |
| State | Published - 28 Feb 2024 |
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