Influence of solidification rate on solid-liquid interface of Si-Ta alloy

Chun Juan Cui, Jun Zhang, Kun Wu, De Ning Zou, Lin Liu, Heng Zhi Fu

Research output: Contribution to journalArticlepeer-review

Abstract

The influence of solidification rate on the solid-liquid interface of Si-Ta alloy was studied by the zero power method. The results show that the solid-liquid interface morphology has the following evolution processing: planar interface→shallow cell interface→cell interface→shallow cell interface→planar interface when the solidification rate varies from 0.3 mm/min to 9.0 mm/min. At the lower solidification rates, the experiment results can be consistent with Jackson-Hunt theory well. However, there is a deviation between the theory calculation and the experiment at the higher solidification rates. This is caused by the change of the thermodynamics and kinetics, and the solid-liquid interface can get to planar interface at the solidification rate V=5.0 mm/min.

Original languageEnglish
Pages (from-to)60-64
Number of pages5
JournalCailiao Gongcheng/Journal of Materials Engineering
Issue number8
StatePublished - Aug 2012

Keywords

  • Directional solidification
  • Electron beam floating zone melting
  • Solid-liquid interface
  • Solidification rate

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