In-plane thermal expansion behavior of dense ceramic matrix composites containing SiBC matrix

In order to reveal the effect of matrix cracks resulted from thermal residual stresses (TRS) on the thermal expansion behavior of ceramic matrix composites, SiBC matrix was introduced into C_f/SiC and SiC_f/SiC by liquid silicon infiltration. The TRS in both two composites were enlarged with incorporating SiBC matrix which has higher coefficients of thermal expansion (CTEs) than SiC matrix. Due to the relatively high TRS, matrix cracks and fiber/matrix (f/m) debonding exist in C_f/SiC-SiBC, which would provide the space for the expansion of matrix with higher CTEs. For SiC_f/SiC, no matrix cracking and f/m debonding took place due to the close CTEs between fiber and matrix. Accordingly, with the incorporation of SiBC matrix, the in-plane CTE of C_f/SiC between room temperature to 1100 °C decreases from 3.65 × 10⁻⁶ to 3.19 × 10⁻⁶ K^-1, while the in-plane CTE of SiC_f/SiC between room temperature to 1100 °C increases slightly from 4.97 × 10⁻⁶ to 5.03 × 10⁻⁶ K^-1.