Abstract
Ag-Cu alloy film was deposited by arc ion plating (AIP). Atomic oxygen (AO) irradiation experiments were conducted using a ground AO simulation facility. The structure, morphology, composition and tribological property of the Ag-Cu alloy film before and after AO irradiation were investigated and compared with Ag film using X-ray diffraction (XRD), field emission scanning electron microscope (FESEM), X-ray photoelectron spectroscope (XPS) and ball-on-disk tribometer, respectively. In depth XPS analysis clearly shows that the affected thickness of Ag-Cu alloy film was greatly reduced and the oxidation product was mainly Ag 2 O, but AgO and Ag 2 O in case of pure Ag film. As a result, the Ag-Cu alloy film exhibited better AO resistant behaviors, and showed a stable friction and low wear after the AO irradiation. The AO resistant behaviors of the Ag-Cu alloy film were discussed in terms of the film microstructure.
| Original language | English |
|---|---|
| Pages (from-to) | 7643-7648 |
| Number of pages | 6 |
| Journal | Applied Surface Science |
| Volume | 257 |
| Issue number | 17 |
| DOIs | |
| State | Published - 15 Jun 2011 |
| Externally published | Yes |
Keywords
- Ag-Cu alloy film
- Atomic oxygen
- Microstructure
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